Chih-Hsuan Tai

This inventor holds 51 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Hsuan Tai. Retrieved from https://idiyas.com/inventor/chih-hsuan-tai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 51 (Patent Applications = 8)

% Patents Active = 100.0

Average Co-Inventor Count = 7.3

ph-index = 4

Forward Citations = 68(Granted Patents)

Location History:

Hsinchu, TW (2017 - 2023)
Taipei, TW (2018 - 2024)

Company Filing History:

51 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2017-2026

Loading Chart...

Areas of Expertise:

Package Structure

Semiconductor Structure

Sensor Package

Manufacturing Method

Conductive Patterns

Delamination Sensor

Fingerprint Sensor

Through Via

Package-on-Package

Integrated Fan-Out

Under-Bump Metallization

Surface Mount Component

51 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12557707 - Method of fabricating package structure (2026-02-17),

2. 12512372 - Semiconductor structure with testing pads and method of manufacturing thereof (2025-12-30),

3. 12500200 - Package structure with conductive patterns in a redistribution layer (2025-12-16),

4. 12469768 - Semiconductor package structure and method for forming the same (2025-11-11),

5. 12431446 - Package structure (2025-09-30),

6. 12362274 - Package structure and method of forming the same (2025-07-15),

7. 12334434 - Package structure and method of forming the same (2025-06-17),

8. 12278208 - Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer (2025-04-14),

9. 12222545 - Package and method of forming same (2025-02-11),

10. 12205860 - Sensor packages (2025-01-21),

11. 12125810 - Delamination sensor (2024-10-22),

12. 12100682 - Package structure with conductive patterns in a redistribution layer (2024-09-24),

13. 12068212 - Package structure with through via extending through redistribution layer and method of manufacturing the same (2024-08-20),

14. 12015017 - Package structure, package-on-package structure and method of fabricating the same (2024-06-18),

15. 12009322 - Package structure with through-via in molding compound and dielectric layer (2024-06-11),

Title: The Innovative Journey of Chih-Hsuan Tai

Introduction: Chih-Hsuan Tai, a pioneering inventor hailing from Taipei, Taiwan, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Chih-Hsuan Tai holds several patents in the field of electronics and semiconductor technology, with his most recent patent focusing on advanced nanotechnology applications in microchips.

Career Highlights: With a career spanning over two decades, Chih-Hsuan Tai has worked for leading tech companies in Taiwan, where he spearheaded research and development projects that led to the creation of cutting-edge technologies.

Collaborations: Throughout his career, Chih-Hsuan Tai has collaborated with top researchers and engineers in the industry, fostering a culture of innovation and pushing the boundaries of what is possible in the world of technology.

Conclusion: Chih-Hsuan Tai's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his position as a respected inventor in the global tech community, with his work continuing to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

8 patents pending: