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Chih-Hsuan Tai

USPTO Granted Patents = 50 (Patent Applications = 8)

Average Co-Inventor Count = 7.4

ph-index = 4

Forward Citations = 64(Granted Patents)

Location History:

Hsinchu, TW (2017 - 2023)
Taipei, TW (2018 - 2024)

Company Filing History:

50 out of 40,850

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2017-2025

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Areas of Expertise:

Semiconductor Package

Package Structure

Sensor Packages

Delamination Sensor

Fingerprint Sensor

Fan-Out Package

Under-Bump Metallization

Surface Mount Components

Conductive Patterns

Redistribution Layer

Multiple Polarity Groups

Integrated Passive Device

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12512372 - Semiconductor structure with testing pads and method of manufacturing thereof (2025-12-30),

2. 12500200 - Package structure with conductive patterns in a redistribution layer (2025-12-16),

3. 12469768 - Semiconductor package structure and method for forming the same (2025-11-11),

4. 12431446 - Package structure (2025-09-30),

5. 12362274 - Package structure and method of forming the same (2025-07-15),

6. 12334434 - Package structure and method of forming the same (2025-06-17),

7. 12278208 - Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer (2025-04-14),

8. 12222545 - Package and method of forming same (2025-02-11),

9. 12205860 - Sensor packages (2025-01-21),

10. 12125810 - Delamination sensor (2024-10-22),

11. 12100682 - Package structure with conductive patterns in a redistribution layer (2024-09-24),

12. 12068212 - Package structure with through via extending through redistribution layer and method of manufacturing the same (2024-08-20),

13. 12015017 - Package structure, package-on-package structure and method of fabricating the same (2024-06-18),

14. 12009322 - Package structure with through-via in molding compound and dielectric layer (2024-06-11),

15. 11929318 - Package structure and method of forming the same (2024-03-12),

Title: The Innovative Journey of Chih-Hsuan Tai

Introduction: Chih-Hsuan Tai, a pioneering inventor hailing from Taipei, Taiwan, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Chih-Hsuan Tai holds several patents in the field of electronics and semiconductor technology, with his most recent patent focusing on advanced nanotechnology applications in microchips.

Career Highlights: With a career spanning over two decades, Chih-Hsuan Tai has worked for leading tech companies in Taiwan, where he spearheaded research and development projects that led to the creation of cutting-edge technologies.

Collaborations: Throughout his career, Chih-Hsuan Tai has collaborated with top researchers and engineers in the industry, fostering a culture of innovation and pushing the boundaries of what is possible in the world of technology.

Conclusion: Chih-Hsuan Tai's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his position as a respected inventor in the global tech community, with his work continuing to inspire future generations of inventors and innovators.

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