The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Feb. 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chih-Hsuan Tai, Taipei, TW;
Hao-Yi Tsai, Hsinchu, TW;
Tsung-Hsien Chiang, Hsinchu, TW;
Yu-Chih Huang, Hsinchu, TW;
Chia-Hung Liu, Hsinchu, TW;
Ban-Li Wu, Hsinchu, TW;
Ying-Cheng Tseng, Tainan, TW;
Po-Chun Lin, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and including a sensing region, a second encapsulant laterally covering the die, and a redistribution structure disposed on the die and the second encapsulant. An outer sidewall of the second encapsulant is laterally offset from an outer sidewall of the first encapsulant. The die is electrically coupled to the substrate through the redistribution structure, and the redistribution structure includes a hollow region overlying the sensing region of the die.