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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chia-Hung Liu

This inventor holds 33 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Industrial Technology Research Institute. Active years: 2010-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Hung Liu. Retrieved from https://idiyas.com/inventor/chia-hung-liu-tt19tccb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 33 

% Patents Active = 100.0

Average Co-Inventor Count = 5.8

ph-index = 4

Forward Citations = 41(Granted Patents)


Location History:

  • Hsinchu County, TW (2010)
  • Hsinchu, TW (2013 - 2024)

Company Filing History:

goldMedal31 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 9,308 
 
Industrial Technology Research Institute
 patents

Years Active: 2010-2026

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Areas of Expertise:
Semiconductor Package
Manufacturing Method
Package Structure
Fingerprint Sensor
Fan-Out Package
Device Die
Through Via
Touch Sensing Electrode
Circuit Substrate
3D Stacking
Thermal Management
33 patents (USPTO):Explore Patents
1. 12757802 - Semiconductor device and method of forming the same (2026-10-06),
2. 12757758 - Semiconductor package and manufacturing method of semiconductor package (2026-10-06),
3. 12568827 - Method for fabricating device die (2026-03-03),
4. 12557707 - Method of fabricating package structure (2026-02-17),
5. 12381163 - Semiconductor package and manufacturing method thereof (2025-08-05),
6. 12362274 - Package structure and method of forming the same (2025-07-15),
7. 12334434 - Package structure and method of forming the same (2025-06-17),
8. 12176279 - Package structure and manufacturing method thereof (2024-12-24),
9. 12113022 - Semiconductor package and manufacturing method of semiconductor package (2024-10-08),
10. 12068212 - Package structure with through via extending through redistribution layer and method of manufacturing the same (2024-08-20),
11. 12015017 - Package structure, package-on-package structure and method of fabricating the same (2024-06-18),
12. 12002768 - Semiconductor package and manufacturing method thereof (2024-06-04),
13. 11929318 - Package structure and method of forming the same (2024-03-12),
14. 11916025 - Device die and method for fabricating the same (2024-02-27),
15. 11855232 - Semiconductor package and forming method thereof (2023-12-26),

Title: Chia-Hung Liu: Innovator from Hsinchu

Introduction: Chia-Hung Liu is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chia-Hung Liu holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Chia-Hung Liu has worked with leading tech companies and research institutions, playing a pivotal role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Chia-Hung Liu has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing to drive progress in the field of technology.

Conclusion: Chia-Hung Liu's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his reputation as a visionary inventor, shaping the future of technology and inspiring the next generation of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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