The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Apr. 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chih-Hsuan Tai, Taipei, TW;
Chih-Hua Chen, Hsinchu County, TW;
Hao-Yi Tsai, Hsinchu, TW;
Yu-Chih Huang, Hsinchu, TW;
Chia-Hung Liu, Hsinchu, TW;
Ting-Ting Kuo, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package structure and a method of manufacturing the same are provided. The package structure includes a die, an encapsulant, a first redistribution line (RDL) structure, a second RDL structure, a conductive terminal, and a through via. The encapsulant laterally encapsulates the die. The first redistribution line (RDL) structure on a first side of the die and the encapsulant, wherein the first RDL structure comprises a dielectric layer and a redistribution layer in the dielectric layer. The second RDL structure is located on a second side of the die and the encapsulant. The conductive terminal is connected to the redistribution layer. The through via extends through the encapsulant and the redistribution layer to contact the conductive terminal and the second RDL structure.