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For the Inventor, By the Inventor

Zhubei, Taiwan

Chih-Hua Chen

This inventor holds 115 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging (CPC class H01L23-3128). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Industrial Technology Research Institute. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Hua Chen. Retrieved from https://idiyas.com/inventor/chih-hua-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 115 

% Patents Active = 89.6

Average Co-Inventor Count = 4.2

ph-index = 15

Forward Citations = 1,053(Granted Patents)

Forward Citations (Not Self Cited) = 995(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Jhubei, TW (2011 - 2017)
  • Taipei, TW (2009 - 2018)
  • Zhubei, TW (2014 - 2024)
  • Hsinchu County, TW (2017 - 2024)
  • Hsinchu, TW (2018 - 2024)

Company Filing History:

goldMedal113 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 9,303 
 
Industrial Technology Research Institute
 patents

Years Active: 2009-2026

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Areas of Expertise:
Semiconductor Package
Fingerprint Sensor
Wafer Carriers
Thermal Management
InFO Structure
Passive Devices
Package Structures
Gripper Mechanisms
Manufacturing Method
Thermal Relaxation Block
Dielectric Layer
Touch Sensing Electrode
115 patents (USPTO):Explore Patents
1. 12557681 - Semiconductor package and method of manufacturing the same (2026-02-17),
2. 12515349 - Robot gripper for moving wafer carriers and packing materials and method of operating the same (2026-01-06),
3. 12431446 - Package structure (2025-09-30),
4. 12394242 - Fingerprint sensor device and method (2025-08-19),
5. 12260669 - Fingerprint sensor in InFO structure and formation method (2025-03-25),
6. 12255196 - Semiconductor package with thermal relaxation block and manufacturing method thereof (2025-03-18),
7. 12068212 - Package structure with through via extending through redistribution layer and method of manufacturing the same (2024-08-20),
8. 12058101 - Package structure and method of forming the same (2024-08-06),
9. 12017342 - Robot gripper for moving wafer carriers and packing materials and method of operating the same (2024-06-25),
10. 12009322 - Package structure with through-via in molding compound and dielectric layer (2024-06-11),
11. 11961791 - Package structures and methods for forming the same (2024-04-16),
12. 11948862 - Package structures and method of forming the same (2024-04-02),
13. 11847852 - Manufacturing method of fingerprint sensor (2023-12-19),
14. 11830866 - Semiconductor package with thermal relaxation block and manufacturing method thereof (2023-11-28),
15. 11830781 - Package structure and manufacturing method thereof (2023-11-28),

Title: The Innovative Journey of Chih-Hua Chen

Introduction: Chih-Hua Chen, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Chih-Hua Chen holds several patents in the areas of electronics and software development, showcasing his continuous commitment to innovation and creativity.

Career Highlights: Throughout his illustrious career, Chih-Hua Chen has worked with leading tech companies, where he has spearheaded projects that have revolutionized the industry. His keen eye for detail and passion for problem-solving have led to the creation of cutting-edge technologies.

Collaborations: Chih-Hua Chen has collaborated with top researchers and engineers in the field, fostering a culture of innovation and knowledge-sharing. His ability to work effectively in teams has resulted in the successful development of groundbreaking products.

Conclusion: Chih-Hua Chen's dedication to innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor. His contributions to the world of technology continue to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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