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Chih-Hua Chen

USPTO Granted Patents = 114 (Patent Applications = 5)

Average Co-Inventor Count = 4.2

ph-index = 15

Forward Citations = 1,044(Granted Patents)

Forward Citations (Not Self Cited) = 995(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Jhubei, TW (2011 - 2017)
Taipei, TW (2009 - 2018)
Zhubei, TW (2014 - 2024)
Hsinchu County, TW (2017 - 2024)
Hsinchu, TW (2018 - 2024)

Company Filing History:

112 out of 40,927

Taiwan Semiconductor Manufacturing Comp. Ltd.

Industrial Technology Research Institute

Years Active: 2009-2026

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Areas of Expertise:

Fingerprint Sensors

Semiconductor Packaging

Package Structures

Thermal Relaxation Blocks

Robot Grippers

Passive Devices

Info Structure

Fan-Out Package

Touch Sensing Electrodes

Wafer Carriers

Packaging Mechanisms

Pixel Arrays

114 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12515349 - Robot gripper for moving wafer carriers and packing materials and method of operating the same (2026-01-06),

2. 12431446 - Package structure (2025-09-30),

3. 12394242 - Fingerprint sensor device and method (2025-08-19),

4. 12260669 - Fingerprint sensor in InFO structure and formation method (2025-03-25),

5. 12255196 - Semiconductor package with thermal relaxation block and manufacturing method thereof (2025-03-18),

6. 12068212 - Package structure with through via extending through redistribution layer and method of manufacturing the same (2024-08-20),

7. 12058101 - Package structure and method of forming the same (2024-08-06),

8. 12017342 - Robot gripper for moving wafer carriers and packing materials and method of operating the same (2024-06-25),

9. 12009322 - Package structure with through-via in molding compound and dielectric layer (2024-06-11),

10. 11961791 - Package structures and methods for forming the same (2024-04-16),

11. 11948862 - Package structures and method of forming the same (2024-04-02),

12. 11847852 - Manufacturing method of fingerprint sensor (2023-12-19),

13. 11830866 - Semiconductor package with thermal relaxation block and manufacturing method thereof (2023-11-28),

14. 11830781 - Package structure and manufacturing method thereof (2023-11-28),

15. 11749640 - Semiconductor package and method of manufacturing the same (2023-09-05),

Title: The Innovative Journey of Chih-Hua Chen

Introduction: Chih-Hua Chen, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Chih-Hua Chen holds several patents in the areas of electronics and software development, showcasing his continuous commitment to innovation and creativity.

Career Highlights: Throughout his illustrious career, Chih-Hua Chen has worked with leading tech companies, where he has spearheaded projects that have revolutionized the industry. His keen eye for detail and passion for problem-solving have led to the creation of cutting-edge technologies.

Collaborations: Chih-Hua Chen has collaborated with top researchers and engineers in the field, fostering a culture of innovation and knowledge-sharing. His ability to work effectively in teams has resulted in the successful development of groundbreaking products.

Conclusion: Chih-Hua Chen's dedication to innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor. His contributions to the world of technology continue to inspire future generations of inventors and innovators.

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