The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Aug. 08, 2023
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chen-Hua Yu, Hsinchu, TW;
Chih-Hua Chen, Zhubei, TW;
Hao-Yi Tsai, Hsinchu, TW;
Yu-Feng Chen, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); G06F 15/16 (2006.01); G06F 21/51 (2013.01); G06F 21/56 (2013.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H04L 9/40 (2022.01); H04L 61/10 (2022.01); H04L 61/4511 (2022.01); H10N 10/01 (2023.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H04L 101/604 (2022.01);
U.S. Cl.
CPC ...
H04L 61/4511 (2022.05); G06F 15/16 (2013.01); G06F 21/51 (2013.01); G06F 21/56 (2013.01); H01L 21/4846 (2013.01); H01L 21/76898 (2013.01); H01L 23/13 (2013.01); H01L 23/481 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/97 (2013.01); H04L 61/10 (2013.01); H04L 63/04 (2013.01); H10N 10/01 (2023.02); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/49811 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1461 (2013.01); H04L 2101/604 (2022.05);
Abstract
Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.