Yu-Feng Chen

This inventor holds 93 USPTO granted patents and 7 published patent applications, primarily in Fingerprint Sensors (CPC class H01L2224-0401). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2026.

USPTO Granted Patents = 93 (Patent Applications = 7)

% Patents Active = 88.2

Average Co-Inventor Count = 5.1

ph-index = 8

Forward Citations = 324(Granted Patents)

Forward Citations (Not Self Cited) = 290(Dec 10, 2025)

Inventors with similar research interests:

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Company Filing History:

93 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2012-2026

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Areas of Expertise:

Fingerprint Sensor

Semiconductor Package

Wireless Charging

InFO Structure

Metal Bumps

Pixel Array

Multi-Die Package

Integrated Circuit

Connector Spacing

Bonding Methods

Thermal Management

Conductive Elements

93 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12598995 - Semiconductor device and method of forming same (2026-04-07),

2. 12394242 - Fingerprint sensor device and method (2025-08-19),

3. 12260669 - Fingerprint sensor in InFO structure and formation method (2025-03-25),

4. 12230595 - Metal bumps and method forming same (2025-02-18),

5. 12058101 - Package structure and method of forming the same (2024-08-06),

6. 11948862 - Package structures and method of forming the same (2024-04-02),

7. 11741737 - Fingerprint sensor in info structure and formation method (2023-08-29),

8. 11727714 - Fingerprint sensor device and method (2023-08-15),

9. 11631993 - Wireless charging devices having wireless charging coils and methods of manufacture thereof (2023-04-18),

10. 11625940 - Fingerprint sensor device and method (2023-04-11),

11. 11476125 - Multi-die package with bridge layer (2022-10-18),

12. 11282817 - Semiconductor device package including embedded conductive elements (2022-03-22),

13. 11194990 - Fingerprint sensor device and method (2021-12-07),

14. 11171016 - Semiconductor package and manufacturing process thereof (2021-11-09),

15. 11075173 - Semiconductor device and method of forming same (2021-07-27),

Title: The Innovative Journey of Inventor Yu-Feng Chen

Introduction: Yu-Feng Chen, a talented inventor hailing from Hsin-Chu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Yu-Feng Chen holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence. His most recent patent focuses on a cutting-edge method for enhancing solar cell efficiency using nanotechnology.

Career Highlights: With a background in electrical engineering, Yu-Feng Chen has worked for leading tech companies in Taiwan, where he honed his skills in research and development. His innovative approach to problem-solving has led to the successful commercialization of several products.

Collaborations: Throughout his career, Yu-Feng Chen has collaborated with top researchers and engineers in the industry, fostering a culture of innovation and knowledge sharing. His collaborative projects have resulted in groundbreaking inventions that have revolutionized the tech landscape.

Conclusion: Yu-Feng Chen's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology. His contributions continue to inspire future generations of inventors and researchers to push the boundaries of what is possible in the realm of inventions.