The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Oct. 10, 2019
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chih-Hsiang Tseng, Hsinchu, TW;
Yu-Feng Chen, Hsinchu, TW;
Cheng Jen Lin, Kaohsiung, TW;
Wen-Hsiung Lu, Tainan, TW;
Ming-Da Cheng, Jhubei, TW;
Kuo-Ching Hsu, Chung-Ho, TW;
Hong-Seng Shue, Zhubei, TW;
Ming-Hong Cha, Hsinchu, TW;
Chao-Yi Wang, Tainan, TW;
Mirng-Ji Lii, Sinpu Township, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.