This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2021-2026.
Company Filing History:
Years Active: 2021-2026
Title: Chih-Hsiang Tseng: Innovator in Semiconductor Technology
Chih-Hsiang Tseng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Chih-Hsiang Tseng holds a patent for a semiconductor device and method of forming the same. This patent describes a semiconductor package that includes a first die with a first substrate, an interconnect structure with multiple metal layers, and a seal ring structure. The design features a polymer layer that aligns with the outer metal structure of the seal ring, showcasing advanced engineering in semiconductor packaging.
Career Highlights
Tseng is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has contributed to the advancement of semiconductor devices, enhancing their efficiency and reliability.
Collaborations
Chih-Hsiang Tseng has collaborated with notable colleagues such as Yu-Feng Chen and Cheng Jen Lin. Their combined expertise has fostered innovation within the semiconductor sector.
Conclusion
Chih-Hsiang Tseng's contributions to semiconductor technology through his patent and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor devices.