Cheng Jen Lin

Title: **The Innovative Genius of Cheng Jen Lin: A Visionary in Integrated Circuit Design**

Introduction

Cheng Jen Lin is a prominent inventor based in Kaohsiung, Taiwan, celebrated for his contributions to the field of integrated circuit design. With an impressive portfolio comprising nine patents, he exemplifies the spirit of innovation in semiconductor technology. His inventive prowess has been instrumental in advancing methods that enhance the functionality and efficiency of integrated circuits.

Latest Patents

Among Cheng’s most notable recent patents are two cutting-edge inventions that stand out in the semiconductor industry. The first patent, titled "Metal bumps and method forming same," introduces a sophisticated method for creating an integrated circuit structure. This process involves forming a patterned passivation layer over a metal pad, utilizing a polymer layer that is substantially free from N-Methyl-2-pyrrolidone (NMP), and incorporates aliphatic amide as a solvent. The result is a well-defined conductive region that optimizes circuit performance.

The second patent, "Process for tuning via profile in dielectric material," outlines a method for forming integrated circuit elements that enhance performance through innovative layering techniques. This process includes the formation of magnetic and conductive layers, as well as a unique photo-sensitive coating approach that allows for precise adjustments in circuit profiles. These patents represent significant advancements in semiconductor fabrication technologies.

Career Highlights

Cheng Jen Lin has dedicated his career to the Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading entity in the semiconductor space. His expertise and inventive contributions have not only propelled his career forward but have also contributed to TSMC's reputation as a global leader in chip design and manufacturing. His continuous work in developing integrated circuit structures has made a lasting impact on product functionality and efficiency.

Collaborations

Throughout his career, Cheng has had the opportunity to collaborate with notable industry professionals, including Ming-Da Cheng and Mirng-Ji Lii. These collaborations have allowed for the exchange of ideas and the pooling of expertise, fostering a creative environment where innovative solutions can be developed. Working alongside such esteemed colleagues has undoubtedly enriched Cheng's innovative journey.

Conclusion

Cheng Jen Lin has made remarkable strides in the field of integrated circuit design through his inventive spirit and commitment to excellence. His latest patents are a testament to his ingenuity and problem-solving capabilities, contributing significantly to the evolution of semiconductor technology. As a pivotal figure at TSMC, Cheng's impact in the industry will continue to inspire future innovations in integrated circuit design.