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For the Inventor, By the Inventor

Zhubei, Taiwan

Hong-Seng Shue

This inventor holds 30 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hong-Seng Shue. Retrieved from https://idiyas.com/inventor/hong-seng-shue

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 

% Patents Active = 80.0

Average Co-Inventor Count = 5.2

ph-index = 4

Forward Citations = 34(Granted Patents)


Location History:

  • Hsinchu County, TW (2013 - 2024)
  • Zhubei, TW (2015 - 2024)
  • Hsinchu, TW (2024)

Company Filing History:

goldMedal28 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2013-2026

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Areas of Expertise:
Interposer
Copper Edge Seal
Zigzag Patterns
Dual-Layer Inductor
Defect Detection
Shielding Structures
High-Voltage Super Junction
MEMS Structures
Conductive Via
Semiconductor Devices
Crack Preventing Structure
Optical Inspection
30 patents (USPTO):Explore Patents
1. 12685203 - Bump integration with redistribution layer (2026-07-14),
2. 12622276 - Interposer including a copper edge seal ring structure and methods of forming the same (2026-05-05),
3. 12598995 - Semiconductor device and method of forming same (2026-04-07),
4. 12538836 - Seal ring structure in the peripheral of device dies and with zigzag patterns and method forming same (2026-01-27),
5. 12142582 - Organic interposer including a dual-layer inductor structure and methods of forming the same (2024-11-12),
6. 12087648 - Seal ring structure with zigzag patterns and method forming same (2024-09-10),
7. 12057423 - Bump integration with redistribution layer (2024-08-06),
8. 12040289 - Interposer including a copper edge seal ring structure and methods of forming the same (2024-07-16),
9. 11908790 - Chip structure with conductive via structure and method for forming the same (2024-02-20),
10. 11855022 - Shielding structures (2023-12-26),
11. 11854913 - Method for detecting defects in semiconductor device (2023-12-26),
12. 11848270 - Chip structure and method for forming the same (2023-12-19),
13. 11769741 - Organic interposer including a dual-layer inductor structure and methods of forming the same (2023-09-26),
14. 11380639 - Shielding structures (2022-07-05),
15. 11348884 - Organic interposer including a dual-layer inductor structure and methods of forming the same (2022-05-31),

Title: The Innovative Journey of Inventor Hong-Seng Shue

Introduction: Hong-Seng Shue, a talented male inventor hailing from Zhubei, Taiwan, has made significant contributions to the world of innovations with his creative mind and dedication to progress.

Latest Patents: Hong-Seng Shue's latest patents showcase his commitment to pushing boundaries in technology and design, with a focus on improving everyday life through his inventions.

Career Highlights: Throughout his illustrious career, Hong-Seng Shue has been recognized for his groundbreaking work in various fields, earning accolades for his innovative solutions and forward-thinking approach to problem-solving.

Collaborations: Hong-Seng Shue has collaborated with leading industry experts, research institutions, and universities to further his inventions, demonstrating his ability to work effectively in multidisciplinary teams to bring ideas to life.

Conclusion: In conclusion, Hong-Seng Shue stands as a beacon of innovation in the world of inventors, continually striving to make a positive impact through his groundbreaking creations. His legacy serves as an inspiration for aspiring inventors and a testament to the power of creativity and perseverance in driving progress.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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