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For the Inventor, By the Inventor

Chung-Ho, Taiwan

Kuo-Ching Hsu

USPTO Granted Patents = 56 

Average Co-Inventor Count = 4.4

ph-index = 12

Forward Citations = 1,394(Granted Patents)

Forward Citations (Not Self Cited) = 1,356(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Chung-Ho, TW (2009 - 2024)
  • Taipei, TW (2011 - 2024)
  • New Taipei, TW (2022 - 2024)

Company Filing History:

goldMedal56 out of 40,674 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2009-2025

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Areas of Expertise:
Semiconductor Packaging
3D Packages
Chip Package Structure
Conductive Adhesive Layer
Bonding Structures
Interposer Technology
Wafer Backside Structures
Optical Clock Signal Distribution
Thin Wafer Handling
Bump Structures
Conductive Line Crack Prevention
Three-Dimensional Chip Stack
56 patents (USPTO):Explore Patents
1. 12463150 - Bonding structures in semiconductor packaged device and method of forming same (2025-11-04),
2. 12412827 - Semiconductor die package with conductive line crack prevention design (2025-09-09),
3. 12388003 - Chip package structure with metal-containing layer (2025-08-12),
4. 12354884 - Method for making a packaging substrate (2025-07-08),
5. 12125715 - Chip package structure with nickel layer (2024-10-22),
6. 12040266 - Package substrate, package using the same, and method of manufacturing the same (2024-07-16),
7. 12027435 - Packages including multiple encapsulated substrate blocks and overlapping redistribution structures (2024-07-02),
8. 12002746 - Chip package structure with metal-containing layer (2024-06-04),
9. 11990428 - Bonding structures in semiconductor packaged device and method of forming same (2024-05-21),
10. 11854956 - Semiconductor die package with conductive line crack prevention design (2023-12-26),
11. 11848270 - Chip structure and method for forming the same (2023-12-19),
12. 11842935 - Method for forming a reconstructed package substrate comprising substrates blocks (2023-12-12),
13. 11830745 - 3D packages and methods for forming the same (2023-11-28),
14. 11728180 - Chip package structure with conductive adhesive layer (2023-08-15),
15. 11532583 - Semiconductor structure and manufacturing method thereof (2022-12-20),

Title: Inventor Kuo-Ching Hsu

Introduction: Kuo-Ching Hsu is a renowned inventor hailing from Chung-Ho, Taiwan. He has made significant contributions to the field of innovation with his groundbreaking ideas and inventions.

Latest Patents: Kuo-Ching Hsu holds several patents in various industries, showcasing his diverse range of expertise and creativity in inventing new solutions to existing problems.

Career Highlights: Throughout his career, Kuo-Ching Hsu has been recognized for his innovative spirit and dedication to pushing the boundaries of what is possible. His inventions have not only improved existing technologies but have also opened up new possibilities for future developments.

Collaborations: Kuo-Ching Hsu has collaborated with leading companies and research institutions to bring his inventions to life. His ability to work with multidisciplinary teams has led to the successful implementation of his ideas in real-world applications.

Conclusion: In conclusion, Kuo-Ching Hsu stands as a visionary inventor whose passion for innovation continues to inspire others in the field. His contributions have left a lasting impact on the world of inventions, and his legacy is sure to endure for years to come.

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