Kuo-Ching Hsu

This inventor holds 60 USPTO granted patents and 15 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2009-2026.

USPTO Granted Patents = 60 (Patent Applications = 15)

% Patents Active = 86.7

Average Co-Inventor Count = 4.4

ph-index = 12

Forward Citations = 1,468(Granted Patents)

Forward Citations (Not Self Cited) = 1,356(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Chung-Ho, TW (2009 - 2024)
Taipei, TW (2011 - 2024)
New Taipei, TW (2022 - 2024)

Company Filing History:

60 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2009-2026

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Areas of Expertise:

Semiconductor Device

3D Packages

Interposer

Bonding Structures

Conductive Adhesive

Package Substrate

Chip Structure

Conductive Bump

Isolation Structure

Metal Pillar

Embedded Passive Device

Thermal Management

60 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12642116 - Package substrate (2026-05-26),

2. 12598995 - Semiconductor device and method of forming same (2026-04-07),

3. 12588472 - Via accuracy measurement (2026-03-24),

4. 12550798 - Interposer with built-in wiring for testing an embedded integrated passive device and methods for forming the same (2026-02-10),

5. 12463150 - Bonding structures in semiconductor packaged device and method of forming same (2025-11-04),

6. 12412827 - Semiconductor die package with conductive line crack prevention design (2025-09-09),

7. 12388003 - Chip package structure with metal-containing layer (2025-08-12),

8. 12354884 - Method for making a packaging substrate (2025-07-08),

9. 12125715 - Chip package structure with nickel layer (2024-10-22),

10. 12040266 - Package substrate, package using the same, and method of manufacturing the same (2024-07-16),

11. 12027435 - Packages including multiple encapsulated substrate blocks and overlapping redistribution structures (2024-07-02),

12. 12002746 - Chip package structure with metal-containing layer (2024-06-04),

13. 11990428 - Bonding structures in semiconductor packaged device and method of forming same (2024-05-21),

14. 11854956 - Semiconductor die package with conductive line crack prevention design (2023-12-26),

15. 11848270 - Chip structure and method for forming the same (2023-12-19),

Title: Inventor Kuo-Ching Hsu

Introduction: Kuo-Ching Hsu is a renowned inventor hailing from Chung-Ho, Taiwan. He has made significant contributions to the field of innovation with his groundbreaking ideas and inventions.

Latest Patents: Kuo-Ching Hsu holds several patents in various industries, showcasing his diverse range of expertise and creativity in inventing new solutions to existing problems.

Career Highlights: Throughout his career, Kuo-Ching Hsu has been recognized for his innovative spirit and dedication to pushing the boundaries of what is possible. His inventions have not only improved existing technologies but have also opened up new possibilities for future developments.

Collaborations: Kuo-Ching Hsu has collaborated with leading companies and research institutions to bring his inventions to life. His ability to work with multidisciplinary teams has led to the successful implementation of his ideas in real-world applications.

Conclusion: In conclusion, Kuo-Ching Hsu stands as a visionary inventor whose passion for innovation continues to inspire others in the field. His contributions have left a lasting impact on the world of inventions, and his legacy is sure to endure for years to come.