Sinpu, Taiwan

Mirng-Ji Lii

This inventor holds 220 USPTO granted patents and 34 published patent applications, primarily in Semiconductor Packaging (CPC class H01L24-13). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mirng-Ji Lii. Retrieved from https://idiyas.com/inventor/mirng-ji-lii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 220 

% Patents Active = 85.9

Average Co-Inventor Count = 4.9

ph-index = 19

Forward Citations = 2,746(Granted Patents)

Forward Citations (Not Self Cited) = 2,512(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Kaohsiung, TW (2007 - 2010)
  • Sinpu, TW (2010 - 2014)
  • Hsin-Chu, TW (2006 - 2019)
  • Sinpu Township, Hsinchu County, TW (2009 - 2024)
  • Sinpu Township, TW (2010 - 2024)
  • Hsinchu County, TW (2010 - 2024)

Company Filing History:


Years Active: 2006-2026

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Areas of Expertise:
Semiconductor Device
Chip Package Structure
Heat Conductive Layer
Heterogeneous Bonding
Stacking Via Configuration
Seal Ring Structure
MIMcap Corner Structures
Bonding Structures
Programmable Inductor
Multi-layer Structures
Wafer Level Package
Cavity Substrate
220 patents (USPTO):Explore Patents

Title: Mirng-Ji Lii: A Prolific Innovator in Taiwan

Introduction:

Mirng-Ji Lii, hailing from Sinpu Township, Taiwan, is a highly accomplished inventor with an impressive portfolio of 185 patents. Known for his groundbreaking work in connector structures and display device manufacturing, Lii has made a significant impact in the field of semiconductor technology. This article explores his latest patents, career highlights, notable collaborations, and acknowledges his pivotal contributions.

Latest Patents:

One of Lii's notable patents is the "Connector Structure and Method of Forming Same." This innovation involves a unique method for forming a connector, wherein a patterned passivation layer, seed layer, and mask layer are strategically employed, leading to efficient and reliable connection establishment.

Another recent patent of Lii's is the "Display Device and Manufacturing Method Thereof," which focuses on enhancing display capabilities. By incorporating specific light-emitting layers and electrode arrangements, this technology offers improved pixel performance, sharper images, and enhanced visual experiences.

Career Highlights:

Mirng-Ji Lii's extensive career spans various positions at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading global semiconductor manufacturer. Through his tenure, Lii has risen to prominence due to his exceptional technical skills and groundbreaking contributions to the company's innovation initiatives. His expertise in chip design, process optimization, and fabrication techniques has been instrumental in driving TSMC's success.

Collaborations:

Throughout his career, Lii has had the opportunity to collaborate with several talented individuals, which has further propelled his innovative endeavors. Noteworthy among his coworkers are Chen-Hua Yu and Hao-Yi Tsai. These collaborations have fostered a vibrant environment where their collective expertise and insights have synergistically fueled groundbreaking research and development efforts.

Conclusion:

Mirng-Ji Lii's vast expertise and prolific patent record solidify his reputation as a leading innovator in semiconductor technology. His work in connector structures and display device manufacturing has contributed to advancements that reshape industry standards, leading to more efficient and superior electronic products. As an esteemed member of the Taiwan Semiconductor Manufacturing Company Limited (TSMC), Lii continues to push boundaries and drive innovation, ensuring his lasting impact on the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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