The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Dec. 22, 2023
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
A package substrate includes a dielectric layer structure including a first dielectric layer and a second dielectric layer, a plurality of bonding pads located at a lower surface of the first dielectric layer, a plurality of metal pillars located on an upper surface of the second dielectric layer, and a metal interconnect structure extending from the plurality of bonding pads to the plurality of metal pillars and including a plurality of first metal vias in the first dielectric layer and a plurality of second metal vias in the second dielectric layer, wherein the plurality of first metal vias and the plurality of second metal vias have a cross-sectional diameter that decreases in a direction from the second dielectric layer to the first dielectric layer.