IDiyas

For the Inventor, By the Inventor

Taoyuan, Taiwan

Chia-Jen Cheng

USPTO Granted Patents = 11

Average Co-Inventor Count = 4.8

ph-index = 7

Forward Citations = 169(Granted Patents)


Location History:

  • Taoyuan Hsien, TW (2008)
  • Taoyuan, TW (2003 - 2010)
  • Banicao, TW (2015)
  • Banciao, TW (2011 - 2016)
  • Taipei County, TW (2018)

Company Filing History:

goldMedal11 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2003-2018

Loading Chart...
11 patents (USPTO):Explore Patents
1. 10157839 - Interconnect structure and manufacturing method thereof (2018-12-18),
2. 9515038 - Electrical connection for chip scale packaging (2016-12-06),
3. 9087882 - Electrical connection for chip scale packaging (2015-07-21),
4. 8669658 - Crosstalk-free WLCSP structure for high frequency application (2014-03-11),
5. 8624392 - Electrical connection for chip scale packaging (2014-01-07),
6. 7863742 - Back end integrated WLCSP structure without aluminum pads (2011-01-04),
7. 7781140 - Method of fine pitch bump stripping (2010-08-24),
8. 7459386 - Method for forming solder bumps of increased height (2008-12-02),
9. 7187078 - Bump structure (2007-03-06),
10. 7122458 - Method for fabricating pad redistribution layer (2006-10-17),
11. 6541366 - Method for improving a solder bump adhesion bond to a UBM contact layer (2003-04-01),

Title: Innovations of Chia-Jen Cheng

Introduction

Chia-Jen Cheng is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on innovative interconnect structures and electrical connections for chip scale packaging.

Latest Patents

Cheng's latest patents include an interconnect structure and manufacturing method. This invention features a first substrate with a cavity and a first recess, along with a second substrate and an electronic device housed within the cavity. Additionally, he has developed a system for providing electrical connections that includes a post-passivation layer larger than the underbump metallization, which helps shield underlying layers from thermal expansion stresses.

Career Highlights

Chia-Jen Cheng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to advance semiconductor technologies. His expertise and innovative approach have positioned him as a key figure in his field.

Collaborations

Cheng has collaborated with notable coworkers, including Hsiu-Mei Yu and Li-Hsin Tseng, contributing to various projects and innovations within the company.

Conclusion

Chia-Jen Cheng's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to impact the development of advanced electronic devices.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…