The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2011
Filed:
Nov. 01, 2007
Hsiu-mei Yu, Hsin-Chu, TW;
Tjandra Winata Karta, Chu-Pei, TW;
Daniel Yang, Hsin-Chu, TW;
Shih-ming Chen, Jhunan, TW;
Chia-jen Cheng, Banciao, TW;
Hsiu-Mei Yu, Hsin-Chu, TW;
Tjandra Winata Karta, Chu-Pei, TW;
Daniel Yang, Hsin-Chu, TW;
Shih-Ming Chen, Jhunan, TW;
Chia-Jen Cheng, Banciao, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An integrated circuit structure includes a passivation layer; a via opening in the passivation layer; a copper-containing via in the via opening; a polymer layer over the passivation layer, wherein the polymer layer comprises an aperture, and wherein the copper-containing via is exposed through the aperture; a post-passivation interconnect (PPI) line over the polymer layer, wherein the PPI line extends into the aperture and physically contacts the copper-via opening; and an under-bump metallurgy (UBM) over and electrically connected to the PPI line.