Hsiu-Mei Yu

This inventor holds 27 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Vanguard International Semiconductor Corporation. Active years: 2002-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsiu-Mei Yu. Retrieved from https://idiyas.com/inventor/hsiu-mei-yu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 27 (Patent Applications = 2)

% Patents Active = 74.1

Average Co-Inventor Count = 4.2

ph-index = 10

Forward Citations = 311(Granted Patents)

Location History:

Zhudong Township, Hsinchu County, TW (2018)
Hsin-Chu, TW (2002 - 2024)

Company Filing History:

21 out of 42,965

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

6 out of 1,133

Vanguard International Semiconductor Corporation

patents

Years Active: 2002-2026

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Areas of Expertise:

Semiconductor Structure

Chip Package

Thermal Dissipation

Electrical Connection

Dicing Methods

WLCSP Structure

Bump Structure

Polymer Dielectric

Substrate Pretreatment

Solder Bump

Interconnect Structure

High-Efficiency Packaging

27 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12588235 - Semiconductor structure and manufacturing method of the same (2026-03-24),

2. 12131973 - Semiconductor device and method forming the same (2024-10-29),

3. 11935878 - Package structure and method for manufacturing the same (2024-03-19),

4. 11810804 - Method of forming dice and structure of die (2023-11-07),

5. 11588036 - High-efficiency packaged chip structure and electronic device including the same (2023-02-21),

6. 11309201 - Method of forming dice and structure of die (2022-04-19),

7. 10797007 - Semiconductor structure and manufacturing method thereof (2020-10-06),

8. 10157839 - Interconnect structure and manufacturing method thereof (2018-12-18),

9. 9870975 - Chip package with thermal dissipation structure and method for forming the same (2018-01-16),

10. 9515038 - Electrical connection for chip scale packaging (2016-12-06),

11. 9087882 - Electrical connection for chip scale packaging (2015-07-21),

12. 8669641 - Diffusion region routing for narrow scribe-line devices (2014-03-11),

13. 8624392 - Electrical connection for chip scale packaging (2014-01-07),

14. 8048778 - Methods of dicing a semiconductor structure (2011-11-01),

15. 7968431 - Diffusion region routing for narrow scribe-line devices (2011-06-28),

Title: Inventor Hsiu-Mei Yu: Revolutionizing Technology in Hsinchu

Introduction: Hsiu-Mei Yu is a pioneering inventor based in Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology.

Latest Patents: Hsiu-Mei Yu holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing her diverse range of expertise.

Career Highlights: With a career spanning over two decades, Hsiu-Mei Yu has worked with leading tech companies and research institutions, consistently pushing the boundaries of innovation.

Collaborations: Throughout her career, Hsiu-Mei Yu has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Hsiu-Mei Yu's relentless pursuit of innovation and her passion for technology have solidified her reputation as a visionary inventor in Hsinchu and beyond.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: