The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Dec. 10, 2010
Chin-yu Ku, Hsinchu, TW;
Hsiu-mei Yu, Hsinchu, TW;
Chun-ying Lin, Tuku Township, TW;
Young-chang Lien, Taipei, TW;
Sheng-hsiang Chiu, Tainan, TW;
Ta-jen Yu, Taichung, TW;
Chin-Yu Ku, Hsinchu, TW;
Hsiu-Mei Yu, Hsinchu, TW;
Chun-Ying Lin, Tuku Township, TW;
Young-Chang Lien, Taipei, TW;
Sheng-Hsiang Chiu, Tainan, TW;
Ta-Jen Yu, Taichung, TW;
Abstract
An embodiment of the disclosure includes a method of dicing a semiconductor structure. A device layer on a semiconductor substrate is provided. The device layer has a first chip region and a second chip region. A scribe line region is between the first chip region and the second chip region. A protective layer is formed over the device layer thereby over the semiconductor substrate. The protective layer on the scribe line region is laser sawn to form a notch. The notch extends into the semiconductor substrate and the protective layer is formed to cover a portion of the notch. A mechanically sawing is performed through the portion of the protective layer and the substrate to separate the first chip region and the second chip region.