Company Filing History:
Years Active: 2011
Title: Young-Chang Lien: Innovator in Semiconductor Technology
Introduction
Young-Chang Lien is a distinguished inventor based in Taipei, Taiwan, recognized for his contributions to semiconductor technology. He holds two patents that showcase his innovative methods in enhancing semiconductor structures and improving manufacturing processes.
Latest Patents
Lien's latest patents include "Methods of dicing a semiconductor structure" and "Structure and method for forming pillar bump structure having sidewall protection." The dicing method involves a sophisticated approach of forming a protective layer over a semiconductor substrate, with intricate steps that feature laser sawing to create notches that facilitate chip separation. The second patent focuses on a method for creating a metal pillar bump structure, emphasizing the formation of cavities and encapsulating the metal layer with solder material, which enhances reliability in semiconductor applications.
Career Highlights
Young-Chang Lien is currently employed at Taiwan Semiconductor Manufacturing Company Limited, one of the leading firms in the semiconductor industry. His role involves collaborating on cutting-edge semiconductor innovations, where he applies his expertise to develop methods that optimize chip manufacturing processes.
Collaborations
Throughout his career, Lien has collaborated with notable colleagues such as Chin-Yu Ku and Hsiu-Mei Yu. These partnerships have led to significant advancements in the field of semiconductor manufacturing, further solidifying Lien's reputation as a key player in the industry.
Conclusion
With a robust portfolio of patents and a commitment to innovation, Young-Chang Lien continues to shape the future of semiconductor technology. His methods not only improve manufacturing efficiency but also enhance the overall performance of semiconductor devices, marking him as a prominent inventor in this dynamic field.