The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Jul. 14, 2016
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chin-Hua Wang, New Taipei, TW;
Po-Yao Lin, Zhudong Township, Hsinchu County, TW;
Shu-Shen Yeh, Taoyuan, TW;
Kuang-Chun Lee, New Taipei, TW;
Shin-Puu Jeng, Hsinchu County, TW;
Shyue-Ter Leu, Hsinchu, TW;
Cheng-Lin Huang, Hsinchu, TW;
Hsiu-Mei Yu, Zhudong Township, Hsinchu County, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
Structures and formation methods of a chip package are provided. The chip package includes a first package structure including a first semiconductor die that has a first side and a second side opposite thereto. The chip package also includes a package layer partially or completely encapsulating the first semiconductor die, and a conductive feature in the package layer. The chip package further includes a first heat-spreading layer over the first side of the first semiconductor die and a first cap layer on the first heat-spreading layer.