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For the Inventor, By the Inventor

Hsinchu, Taiwan

Cheng-Lin Huang

USPTO Granted Patents = 106 

Average Co-Inventor Count = 3.7

ph-index = 12

Forward Citations = 673(Granted Patents)

Forward Citations (Not Self Cited) = 652(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Taipei, TW (2004 - 2007)
  • Hsinchu, TW (2005 - 2024)

Company Filing History:

goldMedal105 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 832,843 
Other
 patents

Years Active: 2004-2025

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Areas of Expertise:
Chip Package Structure
Fan-Out Package
Through Vias
Metal Oxide Layered Structure
Semiconductor Die Singulation
Conductive External Connector
Thermal Dissipation Structure
Solder Bump
Integrated Fan-Out Package
Non-Vertical Through-Via
Multiple Conductive Features
Bump Layout
106 patents (USPTO):Explore Patents
1. 12489045 - Package structure with through vias (2025-12-02),
2. 12381114 - Package structure with fan-out feature (2025-08-05),
3. 12255173 - Chip package structure (2025-03-18),
4. 12183709 - Chip package structure with ring-like structure (2024-12-31),
5. 12087618 - Method for forming semiconductor die having edge with multiple gradients (2024-09-10),
6. 11948876 - Package structure with through vias (2024-04-02),
7. 11855039 - Chip package structure (2023-12-26),
8. 11854826 - Metal oxide layered structure and methods of forming the same (2023-12-26),
9. 11848302 - Chip package structure with ring-like structure (2023-12-19),
10. 11784091 - Structure and formation method of chip package with fan-out feature (2023-10-10),
11. 11569159 - Structure and formation method of chip package with through vias (2023-01-31),
12. 11545463 - Chip package structure with ring-like structure (2023-01-03),
13. 11532577 - Fan-out package and methods of forming thereof (2022-12-20),
14. 11527504 - Conductive external connector structure and method of forming (2022-12-13),
15. 11456276 - Chip package structure (2022-09-27),

Title: Cheng-Lin Huang: Pioneering Innovator in Hsinchu

Introduction: Cheng-Lin Huang has carved a path of innovation and excellence in the field of invention, inspiring countless inventors and shaping the technological landscape. With a remarkable 101 patents to his name, he continues to push boundaries and redefine industry standards from his base in Hsinchu, Taiwan.

Latest Patents: Among his latest patents, Cheng-Lin Huang has introduced groundbreaking package structures with through vias, enhancing the efficiency and functionality of semiconductor chips. These innovations showcase his commitment to advancing technology through inventive solutions.

Career Highlights: Cheng-Lin Huang's career is studded with achievements at prominent companies like Taiwan Semiconductor Manufacturing Company Limited (TSMC), where his expertise has significantly contributed to the company's success. His dedication to research and development has resulted in numerous cutting-edge patents that have revolutionized the semiconductor industry.

Collaborations: Throughout his career, Cheng-Lin Huang has collaborated with esteemed coworkers such as Jing-Cheng Lin and Shin-Puu Jeng, pooling their collective knowledge and skills to drive innovation forward. These partnerships have further solidified his standing as a trailblazer in the world of technology.

Conclusion: Cheng-Lin Huang's relentless pursuit of innovation and his unwavering dedication to excellence have cemented his legacy as a pioneer in the field of invention. His impact will continue to resonate for years to come, inspiring future generations of inventors to push boundaries and transform the technological landscape.

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