The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Jul. 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A package structure includes a first semiconductor die having a first conductive pad and a second semiconductor die having a second conductive pad. The package structure also includes a conductive structure and a third semiconductor die. The third semiconductor die extends across a portions of the first semiconductor die and the second semiconductor die. A third conductive pad and a fourth conductive pad of the third semiconductor die are aligned with the first conductive pad and the second conductive pad, respectively. The package structure further includes a protective layer surrounding the conductive structure and the third semiconductor die and an insulating layer extending across an interface between the protective layer and the conductive structure. The package structure includes a conductive layer electrically connected to the conductive structure. The conductive layer has a first portion spaced from the conductive structure and a second portion directly above the conductive structure.