Ling-Wei Li

Title: Innovations of Inventor Ling-Wei Li

Introduction

Ling-Wei Li is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 13 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of his latest patents is a package structure with a fan-out feature. This innovative package structure includes a first semiconductor die with a first conductive pad and a second semiconductor die with a second conductive pad. Additionally, it features a conductive structure and a third semiconductor die that extends across portions of the first and second semiconductor dies. The design ensures that the third conductive pad and the fourth conductive pad of the third semiconductor die are aligned with the first and second conductive pads, respectively. The package structure is further enhanced by a protective layer surrounding the conductive structure and the third semiconductor die, along with an insulating layer that extends across the interface between the protective layer and the conductive structure. A conductive layer, which is electrically connected to the conductive structure, is also included in the design.

Another notable patent is a chip package structure that comprises a first substrate and a conductive via structure passing through it. This chip package structure features a barrier layer over the surface of the first substrate, an insulating layer over the barrier layer, and a conductive pad on top of the insulating layer. The conductive pad has a portion that passes through the insulating layer and the barrier layer, connecting to the conductive via structure. Additionally, the structure includes a conductive bump over the conductive pad and a second substrate, with an underfill layer positioned between the first and second substrates.

Career Highlights

Ling-Wei Li is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packaging.

Collaborations

He has collaborated with notable colleagues, including Cheng-Lin Huang and Jung-Hua Chang, contributing to various projects and innovations in the semiconductor field.

Conclusion

Ling-Wei Li's contributions to semiconductor packaging through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative designs continue to shape the future of semiconductor technology.