Kuang-Chun Lee

This inventor holds 24 USPTO granted patents and 14 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuang-Chun Lee. Retrieved from https://idiyas.com/inventor/kuang-chun-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 (Patent Applications = 14)

% Patents Active = 100.0

Average Co-Inventor Count = 5.8

ph-index = 2

Forward Citations = 34(Granted Patents)

Company Filing History:

24 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2017-2026

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Areas of Expertise:

Multi-Die Package

Bonding Structures

Thermal Dissipation

Dummy Through Vias

Chip Package Structure

Warpage Release Layer

Protective Lid

Semiconductor Device

Co-Planarity

Fabricating Method

Package Assembly

Manufacturing Method

24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12557646 - Multi-die package and methods of formation (2026-02-17),

2. 12512331 - Dummy through vias for integrated circuit packages and methods of forming the same (2025-12-30),

3. 12444706 - Package bonding structures and method of formation (2025-10-14),

4. 12368080 - Chip package structure with ring structure (2025-07-22),

5. 12327782 - Systems for semiconductor package mounting with improved co-planarity (2025-06-10),

6. 12300632 - Chip package with lid (2025-05-13),

7. 12283553 - Semiconductor die with warpage release layer structure in package and fabricating method thereof (2025-04-21),

8. 12119276 - Package structure with protective lid (2024-10-15),

9. 11978720 - Semiconductor device package and methods of manufacture (2024-05-07),

10. 11855009 - Chip package with lid (2023-12-26),

11. 11764118 - Structure and formation method of chip package with protective lid (2023-09-19),

12. 11728233 - Chip package structure with ring structure and method for forming the same (2023-08-15),

13. 11694974 - Semiconductor die with warpage release layer structure in package and fabricating method thereof (2023-07-04),

14. 11508710 - Method of forming semiconductor device package (2022-11-22),

15. 11410939 - Chip package with lid (2022-08-09),

Title: Inventor Kuang-Chun Lee: Revolutionizing Technology in New Taipei

Introduction: Kuang-Chun Lee is a visionary inventor based in New Taipei, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Lee holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his innovative spirit and commitment to progress.

Career Highlights: With a career spanning over two decades, Lee has worked tirelessly to develop cutting-edge solutions that have had a significant impact on various industries. His ability to think outside the box and push the boundaries of what is possible has earned him recognition as a pioneer in his field.

Collaborations: Throughout his career, Lee has collaborated with leading technology companies, research institutions, and universities to bring his ideas to life. His collaborative approach has not only led to the successful implementation of his inventions but has also inspired others in the industry to think creatively and embrace innovation.

Conclusion: Kuang-Chun Lee's passion for innovation and his dedication to creating a better future through technology make him a true trailblazer in the world of inventions. His work continues to inspire and shape the technological landscape, leaving a lasting legacy for generations to come.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

14 patents pending: