IDiyas

For the Inventor, By the Inventor

Taipei, Taiwan

Kuang-Chun Lee

USPTO Granted Patents = 22 

Average Co-Inventor Count = 5.9

ph-index = 2

Forward Citations = 33(Granted Patents)


Company Filing History:

goldMedal22 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2017-2025

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):
1. 12444706 - Package bonding structures and method of formation (2025-10-14),
2. 12368080 - Chip package structure with ring structure (2025-07-22),
3. 12327782 - Systems for semiconductor package mounting with improved co-planarity (2025-06-10),
4. 12300632 - Chip package with lid (2025-05-13),
5. 12283553 - Semiconductor die with warpage release layer structure in package and fabricating method thereof (2025-04-21),
6. 12119276 - Package structure with protective lid (2024-10-15),
7. 11978720 - Semiconductor device package and methods of manufacture (2024-05-07),
8. 11855009 - Chip package with lid (2023-12-26),
9. 11764118 - Structure and formation method of chip package with protective lid (2023-09-19),
10. 11728233 - Chip package structure with ring structure and method for forming the same (2023-08-15),
11. 11694974 - Semiconductor die with warpage release layer structure in package and fabricating method thereof (2023-07-04),
12. 11508710 - Method of forming semiconductor device package (2022-11-22),
13. 11410939 - Chip package with lid (2022-08-09),
14. 10797006 - Structure and formation method of chip package with lid (2020-10-06),
15. 10790164 - Method for forming package structure (2020-09-29),

Title: Inventor Kuang-Chun Lee: Revolutionizing Technology in New Taipei

Introduction: Kuang-Chun Lee is a visionary inventor based in New Taipei, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Lee holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his innovative spirit and commitment to progress.

Career Highlights: With a career spanning over two decades, Lee has worked tirelessly to develop cutting-edge solutions that have had a significant impact on various industries. His ability to think outside the box and push the boundaries of what is possible has earned him recognition as a pioneer in his field.

Collaborations: Throughout his career, Lee has collaborated with leading technology companies, research institutions, and universities to bring his ideas to life. His collaborative approach has not only led to the successful implementation of his inventions but has also inspired others in the industry to think creatively and embrace innovation.

Conclusion: Kuang-Chun Lee's passion for innovation and his dedication to creating a better future through technology make him a true trailblazer in the world of inventions. His work continues to inspire and shape the technological landscape, leaving a lasting legacy for generations to come.

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