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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11855009 B1

PDFFull Text
Date of Patent:
Dec. 26, 2023

Filed:

Jul. 01, 2022

Chip package with lid

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shu-Shen Yeh, Taoyuan, TW;

Chin-Hua Wang, New Taipei, TW;

Kuang-Chun Lee, New Taipei, TW;

Po-Yao Lin, Zhudong Township, TW;

Shyue-Ter Leu, Hsinchu, TW;

Shin-Puu Jeng, Po-Shan Village, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Sonya McCall-Shepard

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/04 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/367 (2013.01); H01L 23/3675 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16152 (2013.01);
Abstract

A chip package is provided. The chip package includes a substrate and a semiconductor chip over the substrate. The chip package also includes an upper plate extending across edges of the semiconductor chip. The chip package further includes a first support structure connecting a first corner portion of the substrate and a first corner of the upper plate. In addition, the chip package includes a second support structure connecting a second corner portion of the substrate and a second corner of the upper plate. The upper plate has a side edge connecting the first support structure and the second support structure, and the side edge extends across opposite edges of the semiconductor chip.

Find Patent Forward Citations

Yeh, Shu-Shen. (2023). Chip package with lid (U.S. Patent No. 11855009). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11855009

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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