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For the Inventor, By the Inventor

Taipei, Taiwan

Chin-Hua Wang

This inventor holds 101 USPTO granted patents and 71 published patent applications, primarily in Semiconductor Packaging (CPC class H01L25-0655). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Hua Wang. Retrieved from https://idiyas.com/inventor/chin-hua-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 101 

% Patents Active = 100.0

Average Co-Inventor Count = 5.5

ph-index = 3

Forward Citations = 43(Granted Patents)

Forward Citations (Not Self Cited) = 21(Dec 10, 2025)


Inventors with similar research interests:

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Company Filing History:

goldMedal100 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2017-2026

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Areas of Expertise:
Thermal Management
Stress Reduction
Package Structure
Chip Package
Integrated Circuit
Multi-Chip Device
Liquid Alloy TIM
Manufacturing Method
Dummy Via
Stiffener Ring
Corner Openings
Tapered Sidewall
101 patents (USPTO):Explore Patents
1. 12751304 - Anchor-containing underfill structures for a chip package and methods of forming the same (2026-09-29),
2. 12708050 - Fabricating method of semiconductor die with tapered sidewall in package (2026-08-11),
3. 12702052 - Frame edge reinforcement structure for package structures and methods of using the same (2026-08-04),
4. 12660721 - Reinforced substrates to mitigate underflow stress and package warp and methods of making the same (2026-06-16),
5. 12660627 - Reinforcement structures for chip-interposer and interposer-substrate bonding and methods of making the same (2026-06-16),
6. 12648478 - Package structure and method for forming the same (2026-06-02),
7. 12616029 - Package structure with stiffener ring having slant sidewall (2026-04-28),
8. 12616027 - Semiconductor package structures and methods of forming the same (2026-04-28),
9. 12568824 - Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same (2026-03-03),
10. 12568820 - Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same (2026-03-03),
11. 12557656 - Stacking via structures for stress reduction (2026-02-17),
12. 12519066 - Package structure with a plurality of corner openings comprising different shapes and method of fabricating the same (2026-01-06),
13. 12506090 - Semiconductor package including stress buffers and methods of forming the same (2025-12-23),
14. 12489027 - Semiconductor device and method of manufacture (2025-12-02),
15. 12469814 - Integrated circuit package and method of forming same (2025-11-11),

Title: The Innovative Journey of Chin-Hua Wang

Introduction:

Chin-Hua Wang, a distinguished inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents:

Chin-Hua Wang's latest patents include groundbreaking inventions in the realm of renewable energy technologies and sustainable materials, showcasing his commitment to creating a more environmentally friendly future.

Career Highlights:

With a career spanning over two decades, Chin-Hua Wang has established himself as a visionary in the tech industry. His work has not only revolutionized existing technologies but has also paved the way for new advancements in various sectors.

Collaborations:

Throughout his career, Chin-Hua Wang has collaborated with leading research institutions, universities, and tech companies to bring his innovative ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful development of cutting-edge products and solutions.

Conclusion:

In conclusion, Chin-Hua Wang's passion for innovation, coupled with his technical expertise, has solidified his position as a trailblazer in the world of technology. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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