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For the Inventor, By the Inventor

Taipei, Taiwan

Chin-Hua Wang

USPTO Granted Patents = 88 

Average Co-Inventor Count = 5.6

ph-index = 2

Forward Citations = 31(Granted Patents)

Forward Citations (Not Self Cited) = 21(Dec 10, 2025)


Company Filing History:

goldMedal88 out of 40,674 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2017-2025

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Areas of Expertise:
Semiconductor Device
Integrated Circuit Package
Chip Package Structure
Multi-Chip Device
Stress Reduction Design
Thermal Management Features
Three-Dimensional Integrated Circuits
Dummy Metal Bonding Pads
Liquid Alloy Thermal Interface Material
Warpage Release Layer
Conductive Patterns
Underfill Application
88 patents (USPTO):Explore Patents
1. 12489027 - Semiconductor device and method of manufacture (2025-12-02),
2. 12469814 - Integrated circuit package and method of forming same (2025-11-11),
3. 12417970 - Method for forming chip package structure (2025-09-16),
4. 12406898 - Chip package structure with lid (2025-09-02),
5. 12394752 - Multi-chip device and method of formation (2025-08-19),
6. 12387992 - Package and method for forming the same (2025-08-12),
7. 12387991 - Manufacturing method of semiconductor package (2025-08-12),
8. 12374636 - Semiconductor device package with stress reduction design (2025-07-29),
9. 12374561 - Chip package structure with ring dam (2025-07-29),
10. 12368080 - Chip package structure with ring structure (2025-07-22),
11. 12362268 - Package assembly including package substrate with elongated solder resist opening and methods for forming the same (2025-07-15),
12. 12362256 - Method for forming semiconductor package structure (2025-07-15),
13. 12362197 - Semiconductor die package with ring structure (2025-07-15),
14. 12347793 - Semiconductor package (2025-07-01),
15. 12341091 - Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape (2025-06-24),

Title: The Innovative Journey of Chin-Hua Wang

Introduction:

Chin-Hua Wang, a distinguished inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents:

Chin-Hua Wang's latest patents include groundbreaking inventions in the realm of renewable energy technologies and sustainable materials, showcasing his commitment to creating a more environmentally friendly future.

Career Highlights:

With a career spanning over two decades, Chin-Hua Wang has established himself as a visionary in the tech industry. His work has not only revolutionized existing technologies but has also paved the way for new advancements in various sectors.

Collaborations:

Throughout his career, Chin-Hua Wang has collaborated with leading research institutions, universities, and tech companies to bring his innovative ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful development of cutting-edge products and solutions.

Conclusion:

In conclusion, Chin-Hua Wang's passion for innovation, coupled with his technical expertise, has solidified his position as a trailblazer in the world of technology. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators worldwide.

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