Po-Chen Lai

This inventor holds 53 USPTO granted patents and 46 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2022-2026.

USPTO Granted Patents = 53 (Patent Applications = 46)

% Patents Active = 94.3

Average Co-Inventor Count = 5.7

ph-index = 2

Forward Citations = 16(Granted Patents)

Location History:

Hsinchu County, TW (2022 - 2024)
Hsinchu, TW (2022 - 2024)

Company Filing History:

53 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2022-2026

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Areas of Expertise:

Semiconductor Package

Stress Reduction

Multi-Chip Device

Chip Structure

Fan-Out Package

Conductive Patterns

Warpage Control

Stress Absorber

Heat Spreader

Riveting Structure

Underfill Material

Manufacturing Method

53 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12708050 - Fabricating method of semiconductor die with tapered sidewall in package (2026-08-11),

2. 12696760 - Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof (2026-07-28),

3. 12648478 - Package structure and method for forming the same (2026-06-02),

4. 12538852 - Package structure containing chip structure with inclined sidewalls (2026-01-27),

5. 12512399 - Semiconductor package and method of manufacture (2025-12-30),

6. 12506090 - Semiconductor package including stress buffers and methods of forming the same (2025-12-23),

7. 12500208 - Integrated fan-out package having stress release structure (2025-12-16),

8. 12417970 - Method for forming chip package structure (2025-09-16),

9. 12394752 - Multi-chip device and method of formation (2025-08-19),

10. 12374636 - Semiconductor device package with stress reduction design (2025-07-29),

11. 12368127 - Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall (2025-07-22),

12. 12368080 - Chip package structure with ring structure (2025-07-22),

13. 12362256 - Method for forming semiconductor package structure (2025-07-15),

14. 12341091 - Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape (2025-06-24),

15. 12334451 - Semiconductor package including package substrate with dummy via and method of forming the same (2025-06-17),

Title: The Innovative Journey of Po-Chen Lai

Introduction:

Po-Chen Lai, a distinguished inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Po-Chen Lai's latest patents include cutting-edge developments in the fields of semiconductor technology, renewable energy, and artificial intelligence, showcasing his versatility and forward-thinking approach.

Career Highlights:

With a career spanning over two decades, Po-Chen Lai has worked tirelessly to push the boundaries of technological advancement. His work has been instrumental in revolutionizing the way we interact with devices and harness the power of data.

Collaborations:

Throughout his career, Po-Chen Lai has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life. His ability to work across disciplines and industries has led to the creation of innovative solutions with real-world applications.

Conclusion:

In conclusion, Po-Chen Lai's passion for innovation and his dedication to pushing the limits of technology have solidified his reputation as a visionary inventor. His contributions continue to inspire the next generation of innovators to think boldly and create solutions that shape the future.