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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12500208 B1

PDFFull Text
Date of Patent:
Dec. 16, 2025

Filed:

Jul. 07, 2023

Integrated fan-out package having stress release structure

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ming-Chih Yew, Hsinchu, TW;

Po-Chen Lai, Hsinchu County, TW;

Shu-Shen Yeh, Taoyuan, TW;

Po-Yao Lin, Hsinchu County, TW;

Shin-Puu Jeng, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Marlon T Fletcher

Assistant Examiner:

Christina A Sylvia

Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/08 (2013.01); H01L 25/50 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/08145 (2013.01); H01L 2924/18161 (2013.01);
Abstract

A semiconductor package includes a first die, a second die and a buffer layer. The first die and the second die are stacked on the first die. The buffer layer is disposed on a first sidewall of the second die, wherein a second sidewall opposite to the first sidewall of the second die is flush with a third sidewall of the first die.

Find Patent Forward Citations

Yew, Ming-Chih. (2025). Integrated fan-out package having stress release structure (U.S. Patent No. 12500208). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12500208

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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