Ming-Chih Yew

This inventor holds 122 USPTO granted patents and 82 published patent applications, primarily in Semiconductor Packaging (CPC class H01L24-16). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd., Advanced Chip Engineering Technologies Inc.. Active years: 2011-2026.

USPTO Granted Patents = 122 (Patent Applications = 82)

% Patents Active = 95.9

Average Co-Inventor Count = 5.2

ph-index = 8

Forward Citations = 279(Granted Patents)

Forward Citations (Not Self Cited) = 197(Dec 10, 2025)

Inventors with similar research interests:

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Company Filing History:

119 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 450

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

1 out of 1

Advanced Chip Engineering Technologies Inc.

patent

Years Active: 2011-2026

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Areas of Expertise:

Thermal Interface Material

Stress Buffers

Underfill Technologies

Integrated Circuit Package

Fan-Out Package

Delamination Reduction

Conductive Patterns

Multi-Lid Structures

Dummy Dies

C4 Bonding

Stress Release Structure

Chip Package Structure

122 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12740448 - Deformation-resistant interposer for a local silicon interconnect and methods for forming the same (2026-09-15),

2. 12708050 - Fabricating method of semiconductor die with tapered sidewall in package (2026-08-11),

3. 12648478 - Package structure and method for forming the same (2026-06-02),

4. 12642144 - Multi-bump connection to interconnect structure and manufacturing method thereof (2026-05-26),

5. 12568824 - Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same (2026-03-03),

6. 12557645 - Semiconductor packages with thermal lid and methods of forming the same (2026-02-17),

7. 12550792 - Semiconductor package and method of manufacturing the same (2026-02-10),

8. 12519067 - Two-piece type stiffener structure with beveled surface for delamination reduction and methods for forming the same (2026-01-06),

9. 12512399 - Semiconductor package and method of manufacture (2025-12-30),

10. 12506090 - Semiconductor package including stress buffers and methods of forming the same (2025-12-23),

11. 12500208 - Integrated fan-out package having stress release structure (2025-12-16),

12. 12482780 - Chip package structure including an underfill material portion comprising a cut region (2025-11-25),

13. 12476223 - Semiconductor package and method of manufacturing the same (2025-11-18),

14. 12476203 - Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same (2025-11-18),

15. 12469814 - Integrated circuit package and method of forming same (2025-11-11),

Title: The Innovative Journey of Ming-Chih Yew

Introduction: Ming-Chih Yew, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Ming-Chih Yew holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Ming-Chih Yew has worked with leading tech companies and research institutions, spearheading projects that have revolutionized various industries.

Collaborations: Ming-Chih Yew has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge exchange to drive progress in the field of technology.

Conclusion: Ming-Chih Yew's passion for innovation, coupled with his relentless pursuit of excellence, continues to inspire the next generation of inventors and shape the future of technology.