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Hsinchu, Taiwan

Ming-Chih Yew

USPTO Granted Patents = 111 (Patent Applications = 38)

Average Co-Inventor Count = 5.3

ph-index = 7

Forward Citations = 247(Granted Patents)

Forward Citations (Not Self Cited) = 197(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

110 out of 40,674

Taiwan Semiconductor Manufacturing Comp. Ltd.

Advanced Chip Engineering Technologies Inc.

Years Active: 2011-2025

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Areas of Expertise:

Chip Package Structure

Semiconductor Package

Underfill Material

Integrated Circuit Package

Buffer Layer

Stress Reduction Structures

Organic Interposer

Dummy Dies

Thermal Interface Material

Conductive Patterns

Warpage Control

Reinforcing Structures

111 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12482780 - Chip package structure including an underfill material portion comprising a cut region (2025-11-25),

2. 12476223 - Semiconductor package and method of manufacturing the same (2025-11-18),

3. 12476203 - Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same (2025-11-18),

4. 12469814 - Integrated circuit package and method of forming same (2025-11-11),

5. 12444696 - Package structure (2025-10-14),

6. 12431415 - Buffer block structures for C4 bonding and methods of using the same (2025-09-30),

7. 12412851 - Semiconductor device and method of manufacture (2025-09-09),

8. 12406936 - Semiconductor package with substrate recess and methods for forming the same (2025-09-02),

9. 12406897 - Package structure with buffer layer embedded in lid layer (2025-09-02),

10. 12394698 - Underfill cushion films for packaging substrates and methods of forming the same (2025-08-19),

11. 12368127 - Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall (2025-07-22),

12. 12368114 - Semiconductor device package having warpage control and method of forming the same (2025-07-22),

13. 12362256 - Method for forming semiconductor package structure (2025-07-15),

14. 12347764 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same (2025-07-01),

15. 12347758 - Dual-underfill encapsulation for packaging and methods of forming the same (2025-07-01),

Title: The Innovative Journey of Ming-Chih Yew

Introduction: Ming-Chih Yew, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Ming-Chih Yew holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Ming-Chih Yew has worked with leading tech companies and research institutions, spearheading projects that have revolutionized various industries.

Collaborations: Ming-Chih Yew has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge exchange to drive progress in the field of technology.

Conclusion: Ming-Chih Yew's passion for innovation, coupled with his relentless pursuit of excellence, continues to inspire the next generation of inventors and shape the future of technology.

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