The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Apr. 27, 2022
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Li-Ling Liao, Hsinchu, TW;
Ming-Chih Yew, Hsinchu, TW;
Chia-Kuei Hsu, Hsinchu, TW;
Po-Yao Lin, Zhudong Township, TW;
Shin-Puu Jeng, Po-Shan Village, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
A semiconductor structure includes a fan-out package comprising at least one semiconductor die, a redistribution structure including fan-out bonding pads, and a first underfill material portion located between the at least one semiconductor die and the redistribution structure; a packaging substrate comprising chip-side bonding pads; an array of solder material portions bonded to the chip-side bonding pads and the fan-out bonding pads; a second underfill material portion laterally surrounding the array of solder material portions; and at least one buffer block structure located between a respective neighboring pair of solder material portions within the array of solder material portions and between the fan-out package and the packaging substrate, and laterally surrounded by the second underfill material portion.