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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chia-Kuei Hsu

USPTO Granted Patents = 57 

Average Co-Inventor Count = 5.6

ph-index = 2

Forward Citations = 23(Granted Patents)

Forward Citations (Not Self Cited) = 7(Dec 10, 2025)


Company Filing History:

goldMedal57 out of 40,674 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2020-2025

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Areas of Expertise:
Semiconductor Device
Chip Package Structure
Heat Dissipation
Underfill Materials
Eccentric Via Structures
Three-Dimensional Integrated Circuits
Reinforcing Patches
Metallization Structures
Warpage Control
Organic Interposer
Dual-Underfill Encapsulation
Conductive Patterns
57 patents (USPTO):Explore Patents
1. 12489027 - Semiconductor device and method of manufacture (2025-12-02),
2. 12482780 - Chip package structure including an underfill material portion comprising a cut region (2025-11-25),
3. 12476223 - Semiconductor package and method of manufacturing the same (2025-11-18),
4. 12476203 - Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same (2025-11-18),
5. 12444696 - Package structure (2025-10-14),
6. 12431415 - Buffer block structures for C4 bonding and methods of using the same (2025-09-30),
7. 12424511 - High efficiency heat dissipation using discrete thermal interface material films (2025-09-23),
8. 12394698 - Underfill cushion films for packaging substrates and methods of forming the same (2025-08-19),
9. 12368114 - Semiconductor device package having warpage control and method of forming the same (2025-07-22),
10. 12347764 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same (2025-07-01),
11. 12347758 - Dual-underfill encapsulation for packaging and methods of forming the same (2025-07-01),
12. 12341091 - Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape (2025-06-24),
13. 12322703 - Eccentric via structures for stress reduction (2025-06-03),
14. 12322666 - Package assembly lid and methods for forming the same (2025-06-03),
15. 12315768 - Package assembly including lid with additional stress mitigating feet and methods of making the same (2025-05-27),

Title: Chia-Kuei Hsu - Innovator from Hsinchu, TW

Introduction: Chia-Kuei Hsu is a pioneering inventor hailing from Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chia-Kuei Hsu's most recent patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Chia-Kuei Hsu has worked with leading research institutions and universities to push the boundaries of technological innovation. Her work has been instrumental in shaping the future of sustainable energy solutions.

Collaborations: Throughout her career, Chia-Kuei Hsu has collaborated with top companies in the renewable energy sector, as well as with fellow inventors and researchers, to bring cutting-edge technologies to the market.

Conclusion: Chia-Kuei Hsu's dedication to innovation and her passion for creating a more sustainable future have solidified her reputation as a trailblazer in the field of technology. Her work continues to inspire the next generation of inventors and innovators worldwide.

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