The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2026
Filed:
Sep. 05, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chieh-Ming Chang, New Taipei City, TW;
Chia-Kuei Hsu, Hsinchu City, TW;
Ming-Chih Yew, Hsinchu City, TW;
Shin-Puu Jeng, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A chip package structure is provided. The chip package structure includes a semiconductor die formed over a package substrate and an interconnect structure bonded and electrically connected between the semiconductor die and the package substrate. The chip package structure also includes a stiffener structure formed over the package substrate and covering the semiconductor die. The metal stiffener structure has a metal lid cap portion covering the upper surface of the semiconductor die, a metal ring portion surrounding the metal lid cap portion, and a metal spacer wall portion extending between the metal ring portion and the package substrate to surround the semiconductor die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile