The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
May. 23, 2022
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Chin-Hua Wang, New Taipei City, TW;
Shu-Shen Yeh, Taoyuan City, TW;
Chia-Kuei Hsu, Hsinchu City, TW;
PO-Yao Lin, Zhudong Township, TW;
Shin-Puu Jeng, Po-Shan Village, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
An embodiment package substrate may include a core portion including a first material having a first bulk modulus and a first coefficient of thermal expansion, and a reinforcing portion including a second material having a second bulk modulus and a second coefficient of thermal expansion. The second bulk modulus may be chosen to be greater than the first bulk modulus and the second coefficient of thermal expansion may be chosen to be less than the first coefficient of thermal expansion. The core portion may include a fiber-reinforced polymer material and the reinforcing portion may include silicon, silicon nitride, or a ceramic material. The second bulk modulus may be greater than or equal to 100 GPa and the second coefficient of thermal expansion may be less than 10 ppm/° C. The reinforcing portion may include four components each respectively located proximate to a respective corner of the package substrate.