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For the Inventor, By the Inventor

Shu-Shen Yeh

Taoyuan, Taiwan

Shu-Shen Yeh

This inventor holds 140 USPTO granted patents and 83 published patent applications, primarily in Semiconductor Packaging (CPC class H01L24-16). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shu-Shen Yeh. Retrieved from https://idiyas.com/inventor/shu-shen-yeh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 140 

% Patents Active = 100.0

Average Co-Inventor Count = 5.5

ph-index = 4

Forward Citations = 83(Granted Patents)

Forward Citations (Not Self Cited) = 31(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Tainan, TW (2017 - 2018)
  • Taoyuan, TW (2017 - 2024)

Company Filing History:

goldMedal137 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2017-2026

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Areas of Expertise:
Thermal Management
Stress Reduction
Package Structure
Integrated Circuit
Heat Dissipation
Organic Interposer
Dicing Process
Multi-Chip Device
Fan-Out Package
Chip Package
140 patents (USPTO):Explore Patents
1. 12751307 - Semiconductor package (2026-09-29),
2. 12708050 - Fabricating method of semiconductor die with tapered sidewall in package (2026-08-11),
3. 12696760 - Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof (2026-07-28),
4. 12660721 - Reinforced substrates to mitigate underflow stress and package warp and methods of making the same (2026-06-16),
5. 12616029 - Package structure with stiffener ring having slant sidewall (2026-04-28),
6. 12568820 - Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same (2026-03-03),
7. 12557656 - Stacking via structures for stress reduction (2026-02-17),
8. 12557645 - Semiconductor packages with thermal lid and methods of forming the same (2026-02-17),
9. 12550770 - Embedded stress absorber in package (2026-02-10),
10. 12538852 - Package structure containing chip structure with inclined sidewalls (2026-01-27),
11. 12519066 - Package structure with a plurality of corner openings comprising different shapes and method of fabricating the same (2026-01-06),
12. 12512432 - Dicing process in packages comprising organic interposers (2025-12-30),
13. 12512399 - Semiconductor package and method of manufacture (2025-12-30),
14. 12500208 - Integrated fan-out package having stress release structure (2025-12-16),
15. 12489027 - Semiconductor device and method of manufacture (2025-12-02),

Title: The Innovative Journey of Inventor Shu-Shen Yeh

Introduction: Shu-Shen Yeh, a pioneering inventor hailing from Taoyuan, Taiwan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Shu-Shen Yeh's latest patents include a cutting-edge AI-powered healthcare device designed to revolutionize patient care, a sustainable energy solution utilizing solar power, and a smart home automation system for enhanced convenience and security.

Career Highlights: With a career spanning over two decades, Shu-Shen Yeh has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has been recognized globally for its impact on various industries.

Collaborations: Throughout his career, Shu-Shen Yeh has collaborated with leading technology companies, research institutions, and universities to further his research and bring his inventions to life. His collaborative spirit has led to the successful implementation of cutting-edge technologies in real-world applications.

Conclusion: In conclusion, Shu-Shen Yeh's relentless pursuit of innovation and his passion for creating solutions to complex problems have solidified his position as a respected inventor in the global tech community. His contributions continue to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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