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For the Inventor, By the Inventor

Shu-Shen Yeh

Taoyuan, Taiwan

Shu-Shen Yeh

USPTO Granted Patents = 126 

Average Co-Inventor Count = 5.6

ph-index = 3

Forward Citations = 56(Granted Patents)

Forward Citations (Not Self Cited) = 31(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Tainan, TW (2017 - 2018)
  • Taoyuan, TW (2017 - 2024)

Company Filing History:

goldMedal126 out of 40,674 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2017-2025

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Areas of Expertise:
Semiconductor Device
Integrated Circuit Package
Heat Dissipation
Chip Package Structure
Multi-Chip Device
Underfill Cushion Films
Stress Reduction Design
Organic Interposer
Eccentric Via Structures
Three-Dimensional Integrated Circuits
Conductive Line Design
Warpage Control
126 patents (USPTO):Explore Patents
1. 12489027 - Semiconductor device and method of manufacture (2025-12-02),
2. 12469814 - Integrated circuit package and method of forming same (2025-11-11),
3. 12444696 - Package structure (2025-10-14),
4. 12424511 - High efficiency heat dissipation using discrete thermal interface material films (2025-09-23),
5. 12417970 - Method for forming chip package structure (2025-09-16),
6. 12412827 - Semiconductor die package with conductive line crack prevention design (2025-09-09),
7. 12406936 - Semiconductor package with substrate recess and methods for forming the same (2025-09-02),
8. 12406898 - Chip package structure with lid (2025-09-02),
9. 12406897 - Package structure with buffer layer embedded in lid layer (2025-09-02),
10. 12394752 - Multi-chip device and method of formation (2025-08-19),
11. 12394698 - Underfill cushion films for packaging substrates and methods of forming the same (2025-08-19),
12. 12387991 - Manufacturing method of semiconductor package (2025-08-12),
13. 12374636 - Semiconductor device package with stress reduction design (2025-07-29),
14. 12374561 - Chip package structure with ring dam (2025-07-29),
15. 12368127 - Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall (2025-07-22),

Title: The Innovative Journey of Inventor Shu-Shen Yeh

Introduction: Shu-Shen Yeh, a pioneering inventor hailing from Taoyuan, Taiwan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Shu-Shen Yeh's latest patents include a cutting-edge AI-powered healthcare device designed to revolutionize patient care, a sustainable energy solution utilizing solar power, and a smart home automation system for enhanced convenience and security.

Career Highlights: With a career spanning over two decades, Shu-Shen Yeh has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has been recognized globally for its impact on various industries.

Collaborations: Throughout his career, Shu-Shen Yeh has collaborated with leading technology companies, research institutions, and universities to further his research and bring his inventions to life. His collaborative spirit has led to the successful implementation of cutting-edge technologies in real-world applications.

Conclusion: In conclusion, Shu-Shen Yeh's relentless pursuit of innovation and his passion for creating solutions to complex problems have solidified his position as a respected inventor in the global tech community. His contributions continue to inspire future generations of inventors to push the boundaries of what is possible.

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