Average Co-Inventor Count = 5.58
ph-index = 3
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (122 from 40,053 patents)
123 patents:
1. 12424511 - High efficiency heat dissipation using discrete thermal interface material films
2. 12417970 - Method for forming chip package structure
3. 12412827 - Semiconductor die package with conductive line crack prevention design
4. 12406898 - Chip package structure with lid
5. 12406897 - Package structure with buffer layer embedded in lid layer
6. 12406936 - Semiconductor package with substrate recess and methods for forming the same
7. 12394752 - Multi-chip device and method of formation
8. 12394698 - Underfill cushion films for packaging substrates and methods of forming the same
9. 12387991 - Manufacturing method of semiconductor package
10. 12374561 - Chip package structure with ring dam
11. 12374636 - Semiconductor device package with stress reduction design
12. 12368080 - Chip package structure with ring structure
13. 12368127 - Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall
14. 12368114 - Semiconductor device package having warpage control and method of forming the same
15. 12362268 - Package assembly including package substrate with elongated solder resist opening and methods for forming the same