Growing community of inventors

Taoyuan, Taiwan

Shu-Shen Yeh

Average Co-Inventor Count = 5.57

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 54

Shu-Shen YehShin-Puu Jeng (120 patents)Shu-Shen YehPo-Yao Lin (120 patents)Shu-Shen YehChin-Hua Wang (66 patents)Shu-Shen YehYu-Sheng Lin (42 patents)Shu-Shen YehMing-Chih Yew (37 patents)Shu-Shen YehChia-Kuei Hsu (33 patents)Shu-Shen YehChe-Chia Yang (27 patents)Shu-Shen YehPo-Chen Lai (26 patents)Shu-Shen YehShyue-Ter Leu (15 patents)Shu-Shen YehKuang-Chun Lee (15 patents)Shu-Shen YehFeng-Cheng Hsu (7 patents)Shu-Shen YehWen-Yi Lin (5 patents)Shu-Shen YehHui-Chang Yu (5 patents)Shu-Shen YehShuo-Mao Chen (4 patents)Shu-Shen YehChien-Hung Chen (4 patents)Shu-Shen YehChia-Hsiang Lin (4 patents)Shu-Shen YehLi-Ling Liao (4 patents)Shu-Shen YehCheng-Yi Hong (4 patents)Shu-Shen YehChien-Sheng Chen (4 patents)Shu-Shen YehTsung-Yen Lee (3 patents)Shu-Shen YehChih-Kung Huang (3 patents)Shu-Shen YehChien Hung Chen (3 patents)Shu-Shen YehYu Chen Lee (3 patents)Shu-Shen YehTsung-Ming Yeh (3 patents)Shu-Shen YehCheng-Lin Huang (2 patents)Shu-Shen YehChien-Hung Zordius Chen (2 patents)Shu-Shen YehKuo-Ching Hsu (2 patents)Shu-Shen YehKai-Ming Ching (2 patents)Shu-Shen YehHan-Hsiang Huang (2 patents)Shu-Shen YehYu-Min Cheng (2 patents)Shu-Shen YehYa-Huei Lee (2 patents)Shu-Shen YehTsung-Yen Lee (2 patents)Shu-Shen YehHsiu-Mei Yu (1 patent)Shu-Shen YehYu-Huan Chen (1 patent)Shu-Shen YehYi-Hang Lin (1 patent)Shu-Shen YehChien-Shen Chen (1 patent)Shu-Shen YehShin-Puu Zeng (1 patent)Shu-Shen YehYu-Chen Lee (1 patent)Shu-Shen YehYi Hang Lin (1 patent)Shu-Shen YehChia Kuei Hsu (1 patent)Shu-Shen YehShyue Ter Leu (1 patent)Shu-Shen YehShu-Shen Yeh (124 patents)Shin-Puu JengShin-Puu Jeng (658 patents)Po-Yao LinPo-Yao Lin (202 patents)Chin-Hua WangChin-Hua Wang (86 patents)Yu-Sheng LinYu-Sheng Lin (73 patents)Ming-Chih YewMing-Chih Yew (107 patents)Chia-Kuei HsuChia-Kuei Hsu (53 patents)Che-Chia YangChe-Chia Yang (30 patents)Po-Chen LaiPo-Chen Lai (46 patents)Shyue-Ter LeuShyue-Ter Leu (26 patents)Kuang-Chun LeeKuang-Chun Lee (22 patents)Feng-Cheng HsuFeng-Cheng Hsu (110 patents)Wen-Yi LinWen-Yi Lin (27 patents)Hui-Chang YuHui-Chang Yu (8 patents)Shuo-Mao ChenShuo-Mao Chen (122 patents)Chien-Hung ChenChien-Hung Chen (116 patents)Chia-Hsiang LinChia-Hsiang Lin (17 patents)Li-Ling LiaoLi-Ling Liao (11 patents)Cheng-Yi HongCheng-Yi Hong (10 patents)Chien-Sheng ChenChien-Sheng Chen (8 patents)Tsung-Yen LeeTsung-Yen Lee (24 patents)Chih-Kung HuangChih-Kung Huang (20 patents)Chien Hung ChenChien Hung Chen (5 patents)Yu Chen LeeYu Chen Lee (3 patents)Tsung-Ming YehTsung-Ming Yeh (3 patents)Cheng-Lin HuangCheng-Lin Huang (105 patents)Chien-Hung Zordius ChenChien-Hung Zordius Chen (79 patents)Kuo-Ching HsuKuo-Ching Hsu (55 patents)Kai-Ming ChingKai-Ming Ching (45 patents)Han-Hsiang HuangHan-Hsiang Huang (16 patents)Yu-Min ChengYu-Min Cheng (2 patents)Ya-Huei LeeYa-Huei Lee (2 patents)Tsung-Yen LeeTsung-Yen Lee (2 patents)Hsiu-Mei YuHsiu-Mei Yu (26 patents)Yu-Huan ChenYu-Huan Chen (23 patents)Yi-Hang LinYi-Hang Lin (9 patents)Chien-Shen ChenChien-Shen Chen (3 patents)Shin-Puu ZengShin-Puu Zeng (1 patent)Yu-Chen LeeYu-Chen Lee (1 patent)Yi Hang LinYi Hang Lin (1 patent)Chia Kuei HsuChia Kuei Hsu (1 patent)Shyue Ter LeuShyue Ter Leu (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Taiwan Semiconductor Manufacturing Comp. Ltd. (124 from 40,253 patents)


124 patents:

1. 12444696 - Package structure

2. 12424511 - High efficiency heat dissipation using discrete thermal interface material films

3. 12417970 - Method for forming chip package structure

4. 12412827 - Semiconductor die package with conductive line crack prevention design

5. 12406898 - Chip package structure with lid

6. 12406897 - Package structure with buffer layer embedded in lid layer

7. 12406936 - Semiconductor package with substrate recess and methods for forming the same

8. 12394752 - Multi-chip device and method of formation

9. 12394698 - Underfill cushion films for packaging substrates and methods of forming the same

10. 12387991 - Manufacturing method of semiconductor package

11. 12374561 - Chip package structure with ring dam

12. 12374636 - Semiconductor device package with stress reduction design

13. 12368080 - Chip package structure with ring structure

14. 12368127 - Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall

15. 12368114 - Semiconductor device package having warpage control and method of forming the same

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10/26/2025
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