Average Co-Inventor Count = 5.62
ph-index = 2
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (52 from 40,053 patents)
52 patents:
1. 12431415 - Buffer block structures for C4 bonding and methods of using the same
2. 12424511 - High efficiency heat dissipation using discrete thermal interface material films
3. 12394698 - Underfill cushion films for packaging substrates and methods of forming the same
4. 12368114 - Semiconductor device package having warpage control and method of forming the same
5. 12347758 - Dual-underfill encapsulation for packaging and methods of forming the same
6. 12347764 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same
7. 12341091 - Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape
8. 12322703 - Eccentric via structures for stress reduction
9. 12322666 - Package assembly lid and methods for forming the same
10. 12315768 - Package assembly including lid with additional stress mitigating feet and methods of making the same
11. 12300568 - High efficiency heat dissipation using discrete thermal interface material films
12. 12249568 - Metallization structure
13. 12237277 - Package structure and methods of manufacturing the same
14. 12170238 - Semiconductor die package with multi-lid structures and method for forming the same
15. 12154888 - Semiconductor package and method of manufacturing the same