The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Apr. 06, 2022
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Chia-Kuei Hsu, Hsinchu, TW;
Ming-Chih Yew, Hsinchu, TW;
Li-Ling Liao, Hsinchu, TW;
Po-Yao Lin, Zhudong Township, TW;
Shin-Puu Jeng, Po-Shan Village, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
Devices and method for forming a chip package structure including at least one semiconductor die attached to a redistribution structure, a molding compound die frame laterally surrounding the at least one semiconductor die, and a first underfill material portion located between the redistribution structure and the at least one semiconductor die and contacting sidewalls of the at least one semiconductor die and sidewalls of the molding compound die frame. The first underfill material portion may include at least one cut region, in which the first underfill material portion may include a vertically-extending portion having a uniform lateral width and a horizontally-extending portion having a uniform vertical thickness and adjoined to a bottom end of the vertically-extending portion within each of the at least one cut region.