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For the Inventor, By the Inventor

Hsinchu, Taiwan

Li-Ling Liao

This inventor holds 18 USPTO granted patents and 29 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2023-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Li-Ling Liao. Retrieved from https://idiyas.com/inventor/li-ling-liao-d1qltmlc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 100.0

Average Co-Inventor Count = 5.6

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal18 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2023-2026

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Areas of Expertise:
Semiconductor Packages
Package Structure
Stiffener Ring
Inclined Sidewalls
C4 Bonding
Underfill Material
Organic Interposer
Intra-Die Reinforcement
Delamination Reduction
Footprint Reduction
Two-Piece Stiffener
Chip Package Structure
18 patents (USPTO):Explore Patents
1. 12757759 - Method of manufacturing semiconductor packages (2026-10-06),
2. 12648478 - Package structure and method for forming the same (2026-06-02),
3. 12616029 - Package structure with stiffener ring having slant sidewall (2026-04-28),
4. 12538852 - Package structure containing chip structure with inclined sidewalls (2026-01-27),
5. 12519067 - Two-piece type stiffener structure with beveled surface for delamination reduction and methods for forming the same (2026-01-06),
6. 12482780 - Chip package structure including an underfill material portion comprising a cut region (2025-11-25),
7. 12476203 - Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same (2025-11-18),
8. 12431415 - Buffer block structures for C4 bonding and methods of using the same (2025-09-30),
9. 12347764 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same (2025-07-01),
10. 12261102 - Semiconductor package and method of forming the same (2025-03-25),
11. 12176301 - Package structure and method for forming the same (2024-12-24),
12. 12113033 - Chip package structure (2024-10-08),
13. 12040267 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same (2024-07-16),
14. 12014969 - Package structure and method for forming the same (2024-06-18),
15. 11978722 - Structure and formation method of package containing chip structure with inclined sidewalls (2024-05-07),

Title: Inventor Li-Ling Liao: Pioneering Innovations in Hsinchu

Introduction: Li-Ling Liao is a distinguished inventor based in Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Li-Ling Liao holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing her versatility and expertise in various domains.

Career Highlights: With a career spanning over two decades, Li-Ling Liao has worked with leading research institutions and technology companies, playing a pivotal role in the development of cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout her career, Li-Ling Liao has collaborated with top engineers, scientists, and researchers, fostering a culture of innovation and knowledge sharing that has led to the creation of impactful inventions with real-world applications.

Conclusion: Li-Ling Liao's passion for innovation, coupled with her relentless pursuit of excellence, continues to inspire the next generation of inventors and shape the future of technology in Hsinchu and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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