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Hsinchu, Taiwan

Li-Ling Liao

USPTO Granted Patents = 14 (Patent Applications = 6)

Average Co-Inventor Count = 5.7

ph-index = 1

Forward Citations = 2(Granted Patents)

Company Filing History:

14 out of 40,927

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2023-2026

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12519067 - Two-piece type stiffener structure with beveled surface for delamination reduction and methods for forming the same (2026-01-06),

2. 12482780 - Chip package structure including an underfill material portion comprising a cut region (2025-11-25),

3. 12476203 - Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same (2025-11-18),

4. 12431415 - Buffer block structures for C4 bonding and methods of using the same (2025-09-30),

5. 12347764 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same (2025-07-01),

6. 12261102 - Semiconductor package and method of forming the same (2025-03-25),

7. 12176301 - Package structure and method for forming the same (2024-12-24),

8. 12113033 - Chip package structure (2024-10-08),

9. 12040267 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same (2024-07-16),

10. 12014969 - Package structure and method for forming the same (2024-06-18),

11. 11978722 - Structure and formation method of package containing chip structure with inclined sidewalls (2024-05-07),

12. 11728284 - Chip package structure and method for forming the same (2023-08-15),

13. 11705406 - Package structure and method for forming the same (2023-07-18),

14. 11610835 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same (2023-03-21),

Title: Inventor Li-Ling Liao: Pioneering Innovations in Hsinchu

Introduction: Li-Ling Liao is a distinguished inventor based in Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Li-Ling Liao holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing her versatility and expertise in various domains.

Career Highlights: With a career spanning over two decades, Li-Ling Liao has worked with leading research institutions and technology companies, playing a pivotal role in the development of cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout her career, Li-Ling Liao has collaborated with top engineers, scientists, and researchers, fostering a culture of innovation and knowledge sharing that has led to the creation of impactful inventions with real-world applications.

Conclusion: Li-Ling Liao's passion for innovation, coupled with her relentless pursuit of excellence, continues to inspire the next generation of inventors and shape the future of technology in Hsinchu and beyond.

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