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For the Inventor, By the Inventor

Hsinchu, Taiwan

Li-Ling Liao

USPTO Granted Patents = 13 

Average Co-Inventor Count = 5.9

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:

goldMedal13 out of 40,674 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2023-2025

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13 patents (USPTO):Explore Patents
1. 12482780 - Chip package structure including an underfill material portion comprising a cut region (2025-11-25),
2. 12476203 - Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same (2025-11-18),
3. 12431415 - Buffer block structures for C4 bonding and methods of using the same (2025-09-30),
4. 12347764 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same (2025-07-01),
5. 12261102 - Semiconductor package and method of forming the same (2025-03-25),
6. 12176301 - Package structure and method for forming the same (2024-12-24),
7. 12113033 - Chip package structure (2024-10-08),
8. 12040267 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same (2024-07-16),
9. 12014969 - Package structure and method for forming the same (2024-06-18),
10. 11978722 - Structure and formation method of package containing chip structure with inclined sidewalls (2024-05-07),
11. 11728284 - Chip package structure and method for forming the same (2023-08-15),
12. 11705406 - Package structure and method for forming the same (2023-07-18),
13. 11610835 - Organic interposer including intra-die structural reinforcement structures and methods of forming the same (2023-03-21),

Title: Inventor Li-Ling Liao: Pioneering Innovations in Hsinchu

Introduction: Li-Ling Liao is a distinguished inventor based in Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Li-Ling Liao holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing her versatility and expertise in various domains.

Career Highlights: With a career spanning over two decades, Li-Ling Liao has worked with leading research institutions and technology companies, playing a pivotal role in the development of cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout her career, Li-Ling Liao has collaborated with top engineers, scientists, and researchers, fostering a culture of innovation and knowledge sharing that has led to the creation of impactful inventions with real-world applications.

Conclusion: Li-Ling Liao's passion for innovation, coupled with her relentless pursuit of excellence, continues to inspire the next generation of inventors and shape the future of technology in Hsinchu and beyond.

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