The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

May. 15, 2024
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Po-Hao Tsai, Zhongli, TW;

Po-Yao Chuang, Hsinchu, TW;

Ming-Chih Yew, Hsinchu, TW;

Shin-Puu Jeng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 9/28 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/566 (2013.01); H01L 23/3107 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 23/5383 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/045 (2013.01); H01Q 9/285 (2013.01); H01Q 21/062 (2013.01); H01Q 21/065 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01);
Abstract

A device includes a redistribution structure, a first semiconductor device, a first antenna, and a first conductive pillar on the redistribution structure that are electrically connected to the redistribution structure, an antenna structure over the first semiconductor device, wherein the antenna structure includes a second antenna that is different from the first antenna, wherein the antenna structure includes an external connection bonded to the first conductive pillar, and a molding material extending between the antenna structure and the redistribution structure, the molding material surrounding the first semiconductor device, the first antenna, the external connection, and the first conductive pillar.


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