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For the Inventor, By the Inventor

Hsinchu, Taiwan

Po-Yao Chuang

USPTO Granted Patents = 81 

Average Co-Inventor Count = 4.6

ph-index = 5

Forward Citations = 83(Granted Patents)

Forward Citations (Not Self Cited) = 74(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsinchu, TW (2019 - 2024)
  • Hsin-Chu, TW (2024)

Company Filing History:

goldMedal81 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2019-2025

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Areas of Expertise:
Semiconductor Package
Fan-Out Package
Heterogeneous Antenna
Electromagnetic Interference Shielding
Integrated Circuit Packages
3D Semiconductor System
Conductive Via Structure
Chip Package Structure
Passive Devices
Dual-Sided Routing
Interposer Structure
Cavity Substrate
81 patents (USPTO):Explore Patents
1. 12476198 - Package structure with adhesive element over semiconductor chip (2025-11-18),
2. 12463161 - Semiconductor device and method of manufacture (2025-11-04),
3. 12444663 - Semiconductor package including a semiconductor die disposed in a cavity and method for manufacturing thereof (2025-10-14),
4. 12412851 - Semiconductor device and method of manufacture (2025-09-09),
5. 12388028 - Package structure (2025-08-12),
6. 12362341 - Semiconductor devices and methods of manufacturing (2025-07-15),
7. 12354989 - Package structure with conductive via structure (2025-07-08),
8. 12308322 - Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same (2025-05-20),
9. 12308313 - Semiconductor package with improved interposer structure (2025-05-20),
10. 12300592 - Fan-out package with controllable standoff (2025-05-13),
11. 12237262 - Semiconductor package with improved interposer structure (2025-02-25),
12. 12224266 - Semiconductor packages including passive devices and methods of forming same (2025-02-11),
13. 12205861 - Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plate (2025-01-21),
14. 12199084 - Fan-out package with cavity substrate (2025-01-14),
15. 12198996 - Integrated fan-out package, package-on-package structure, and manufacturing method thereof (2025-01-14),

Title: Po-Yao Chuang - Innovative Inventor from Hsinchu

Introduction: Po-Yao Chuang is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Po-Yao Chuang holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and creativity.

Career Highlights: With a career spanning over two decades, Po-Yao Chuang has worked with leading tech companies and research institutions, spearheading projects that have revolutionized the industry.

Collaborations: Throughout his career, Po-Yao Chuang has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing.

Conclusion: Po-Yao Chuang's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and entrepreneurs in Taiwan and beyond.

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