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For the Inventor, By the Inventor

Hsinchu, Taiwan

Po-Yao Chuang

This inventor holds 83 USPTO granted patents and 26 published patent applications, primarily in Semiconductor Packaging (CPC class H01L23-3128). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Po-Yao Chuang. Retrieved from https://idiyas.com/inventor/po-yao-chuang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 83 

% Patents Active = 98.8

Average Co-Inventor Count = 4.6

ph-index = 5

Forward Citations = 104(Granted Patents)

Forward Citations (Not Self Cited) = 74(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hsinchu, TW (2019 - 2024)
  • Hsin-Chu, TW (2024)

Company Filing History:

goldMedal83 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2019-2026

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Areas of Expertise:
Fan-Out Package
Semiconductor Device
EMI Shielding
Interposer Structure
3D Stacking
Cavity Substrate
Adhesive Element
Conductive Via
Passive Devices
Chip Package
Manufacturing Method
Integrated Circuit
83 patents (USPTO):Explore Patents
1. 12671168 - Heterogeneous antenna in fan-out package (2026-06-30),
2. 12532771 - Package structure with fan-out feature (2026-01-20),
3. 12476198 - Package structure with adhesive element over semiconductor chip (2025-11-18),
4. 12463161 - Semiconductor device and method of manufacture (2025-11-04),
5. 12444663 - Semiconductor package including a semiconductor die disposed in a cavity and method for manufacturing thereof (2025-10-14),
6. 12412851 - Semiconductor device and method of manufacture (2025-09-09),
7. 12388028 - Package structure (2025-08-12),
8. 12362341 - Semiconductor devices and methods of manufacturing (2025-07-15),
9. 12354989 - Package structure with conductive via structure (2025-07-08),
10. 12308322 - Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same (2025-05-20),
11. 12308313 - Semiconductor package with improved interposer structure (2025-05-20),
12. 12300592 - Fan-out package with controllable standoff (2025-05-13),
13. 12237262 - Semiconductor package with improved interposer structure (2025-02-25),
14. 12224266 - Semiconductor packages including passive devices and methods of forming same (2025-02-11),
15. 12205861 - Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plate (2025-01-21),

Title: Po-Yao Chuang - Innovative Inventor from Hsinchu

Introduction: Po-Yao Chuang is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Po-Yao Chuang holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and creativity.

Career Highlights: With a career spanning over two decades, Po-Yao Chuang has worked with leading tech companies and research institutions, spearheading projects that have revolutionized the industry.

Collaborations: Throughout his career, Po-Yao Chuang has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing.

Conclusion: Po-Yao Chuang's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and entrepreneurs in Taiwan and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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