The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Apr. 26, 2024
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 19/10 (2006.01); H10W 44/20 (2026.01); H10W 70/05 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10D 84/01 (2025.01); H10P 72/70 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01Q 19/10 (2013.01); H10W 44/20 (2026.01); H10W 70/05 (2026.01); H10W 70/093 (2026.01); H10W 70/095 (2026.01); H10W 70/611 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 74/016 (2026.01); H10W 74/117 (2026.01); H10W 90/401 (2026.01); H10D 84/01 (2025.01); H10P 72/74 (2026.01); H10P 72/7424 (2026.01); H10P 72/743 (2026.01); H10P 72/7436 (2026.01); H10W 44/209 (2026.01); H10W 44/248 (2026.01); H10W 72/0198 (2026.01); H10W 72/072 (2026.01); H10W 72/07207 (2026.01); H10W 72/073 (2026.01); H10W 72/07307 (2026.01); H10W 72/877 (2026.01); H10W 74/014 (2026.01); H10W 74/019 (2026.01); H10W 90/00 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract
A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure. The redistribution structure includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.