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For the Inventor, By the Inventor

Taipei, Taiwan

Shuo-Mao Chen

USPTO Granted Patents = 126 

Average Co-Inventor Count = 4.0

ph-index = 11

Forward Citations = 2,554(Granted Patents)

Forward Citations (Not Self Cited) = 2,419(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsin-Chuang, TW (2012 - 2013)
  • Hsin-Chu, TW (2005 - 2023)
  • New Taipei, TW (2014 - 2024)

Company Filing History:

goldMedal126 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2005-2025

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Areas of Expertise:
Semiconductor Packaging
Multi-Chip Packages
Photonics Integrated Circuits
Integrated Circuit Verification
Thermal Dissipation Blocks
Chip Package Structures
Redistribution Layers
Hybrid Interposers
Passive Devices
Molding Materials
Reinforced Package Structures
Integrated Passive Devices
126 patents (USPTO):Explore Patents
1. 12506008 - Package structure (2025-12-23),
2. 12500158 - Semiconductor structure and manufacturing method thereof (2025-12-16),
3. 12494436 - Integrated passive device dies and methods of forming and placement of the same (2025-12-09),
4. 12476223 - Semiconductor package and method of manufacturing the same (2025-11-18),
5. 12444663 - Semiconductor package including a semiconductor die disposed in a cavity and method for manufacturing thereof (2025-10-14),
6. 12381180 - Multi-chip packages and methods of forming the same (2025-08-05),
7. 12368142 - Double side integration semiconductor package and method of forming the same (2025-07-22),
8. 12355001 - Semiconductor package structure and method for forming the same (2025-07-08),
9. 12354940 - Redistribution layer structure with support features and methods (2025-07-08),
10. 12322742 - Semiconductor structure and manufacturing method thereof (2025-06-03),
11. 12293974 - Photonics integrated circuit package (2025-05-06),
12. 12293141 - Integrated circuit stack verification method and system for performing the same (2025-05-06),
13. 12272629 - Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materials (2025-04-08),
14. 12243800 - Package structure with lid and method for forming the same (2025-03-04),
15. 12224266 - Semiconductor packages including passive devices and methods of forming same (2025-02-11),

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