IDiyas

For the Inventor, By the Inventor

Taipei, Taiwan

Shuo-Mao Chen

USPTO Granted Patents = 123 

Average Co-Inventor Count = 4.0

ph-index = 11

Forward Citations = 2,534(Granted Patents)


Inventors with similar research interests:


Location History:

  • Hsin-Chuang, TW (2012 - 2013)
  • Hsin-Chu, TW (2005 - 2023)
  • New Taipei, TW (2014 - 2024)

Company Filing History:

goldMedal123 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2005-2025

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123 patents (USPTO):
1. 12476223 - Semiconductor package and method of manufacturing the same (2025-11-18),
2. 12444663 - Semiconductor package including a semiconductor die disposed in a cavity and method for manufacturing thereof (2025-10-14),
3. 12381180 - Multi-chip packages and methods of forming the same (2025-08-05),
4. 12368142 - Double side integration semiconductor package and method of forming the same (2025-07-22),
5. 12355001 - Semiconductor package structure and method for forming the same (2025-07-08),
6. 12354940 - Redistribution layer structure with support features and methods (2025-07-08),
7. 12322742 - Semiconductor structure and manufacturing method thereof (2025-06-03),
8. 12293974 - Photonics integrated circuit package (2025-05-06),
9. 12293141 - Integrated circuit stack verification method and system for performing the same (2025-05-06),
10. 12272629 - Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materials (2025-04-08),
11. 12243800 - Package structure with lid and method for forming the same (2025-03-04),
12. 12224266 - Semiconductor packages including passive devices and methods of forming same (2025-02-11),
13. 12218095 - Chip package structure having molding layer (2025-02-04),
14. 12218080 - Package structure with reinforced element (2025-02-04),
15. 12205861 - Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plate (2025-01-21),

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