Feng-Cheng Hsu

This inventor holds 115 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging (CPC class H01L23-3128). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2011-2026.

USPTO Granted Patents = 115 (Patent Applications = 9)

% Patents Active = 94.8

Average Co-Inventor Count = 3.5

ph-index = 9

Forward Citations = 273(Granted Patents)

Forward Citations (Not Self Cited) = 202(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Taipei, TW (2011)
Taipei County, TW (2011)
Sanxia, TW (2013 - 2014)
New Taipei, TW (2016 - 2024)

Company Filing History:

115 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2011-2026

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Areas of Expertise:

Semiconductor Package

Chip Package Structure

Multi-Chip Packages

Integrated Circuit Package

Manufacturing Method

Molding Layer

Redistribution Layer

Reinforcing Patches

Circuit Substrate

Device Encapsulation

Interposer

Dual Sides Routing

115 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12550792 - Semiconductor package and method of manufacturing the same (2026-02-10),

2. 12550757 - Chip package structure (2026-02-10),

3. 12506008 - Package structure (2025-12-23),

4. 12500158 - Semiconductor structure and manufacturing method thereof (2025-12-16),

5. 12476223 - Semiconductor package and method of manufacturing the same (2025-11-18),

6. 12381180 - Multi-chip packages and methods of forming the same (2025-08-05),

7. 12362276 - Semiconductor package having a semiconductor device bonded to a circuit substrate through a floated or grounded dummy conductor and method of manufacturing the same (2025-07-15),

8. 12322742 - Semiconductor structure and manufacturing method thereof (2025-06-03),

9. 12278156 - Semiconductor package (2025-04-14),

10. 12249550 - Semiconductor package and method manufacturing the same (2025-03-11),

11. 12243800 - Package structure with lid and method for forming the same (2025-03-04),

12. 12218095 - Chip package structure having molding layer (2025-02-04),

13. 12176258 - Semiconductor package and method manufacturing the same (2024-12-24),

14. 12154888 - Semiconductor package and method of manufacturing the same (2024-11-26),

15. 12125833 - Integrated circuit package and method forming same (2024-10-22),

Title: Inventor Feng-Cheng Hsu

Introduction: Feng-Cheng Hsu is a renowned inventor hailing from New Taipei, Taiwan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Feng-Cheng Hsu holds several patents in the areas of electronics, renewable energy, and sustainable technologies, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Feng-Cheng Hsu has worked with leading research institutions and technology companies, where he has spearheaded projects that have revolutionized the industry.

Collaborations: Throughout his career, Feng-Cheng Hsu has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and excellence in all his endeavors.

Conclusion: Feng-Cheng Hsu's dedication to pushing the boundaries of technology and his passion for creating solutions to complex problems make him a true pioneer in the world of inventions.