The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Aug. 31, 2021
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Monsen Liu, Hsinchu, TW;
Shuo-Mao Chen, New Taipei, TW;
Po-Ying Lai, Hsinchu, TW;
Shang-Lun Tsai, Hsinchu, TW;
Shin-Puu Jeng, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
Devices and methods of manufacture for a hybrid interposer within a semiconductor device. A semiconductor device may include a package substrate and a hybrid interposer. The hybrid interposer may include an organic interposer material layer, and a non-organic interposer material layer positioned between the organic interposer material layer and the package substrate. The semiconductor device may further include an integrated device positioned within the hybrid interposer. In one embodiment, the integrated device may be positioned within the organic interposer material layer. In another embodiment, the integrated device may be positioned within the non-organic interposer material layer. In a further embodiment, the integrated device may be positioned within the organic interposer material layer and the non-organic interposer material layer.