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For the Inventor, By the Inventor

Zhudong, Taiwan

Monsen Liu

USPTO Granted Patents = 30 

Average Co-Inventor Count = 4.2

ph-index = 8

Forward Citations = 248(Granted Patents)


Location History:

  • Hsinchu County, TW (2016 - 2018)
  • Zhudong Township, TW (2015 - 2024)

Company Filing History:

goldMedal30 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2025

where 'Filed Patents' based on already Granted Patents

30 patents (USPTO):
1. 12368142 - Double side integration semiconductor package and method of forming the same (2025-07-22),
2. 12355001 - Semiconductor package structure and method for forming the same (2025-07-08),
3. 12354940 - Redistribution layer structure with support features and methods (2025-07-08),
4. 12272629 - Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materials (2025-04-08),
5. 11984668 - Method of embedding low-k materials in antennas (2024-05-14),
6. 11764823 - Method of using integrated transmitter and receiver front end module (2023-09-19),
7. 11532868 - Antenna apparatus and method (2022-12-20),
8. 11289449 - Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof (2022-03-29),
9. 11050153 - Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas (2021-06-29),
10. 10872878 - Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof (2020-12-22),
11. 10804953 - Method of using integrated transmitter and receiver front end module (2020-10-13),
12. 10622701 - Antenna apparatus and method (2020-04-14),
13. 10461799 - Integrated transmitter and receiver front end module, transceiver, and related method (2019-10-29),
14. 10297925 - Semiconductor device including integrated fan out antenna and method of forming the same (2019-05-21),
15. 10276401 - 3D shielding case and methods for forming the same (2019-04-30),

Title: **Monsen Liu: A Pioneer in Antenna Technology**

Introduction

Monsen Liu, an innovative inventor from Zhudong, Taiwan, has made significant contributions to the field of semiconductor technology, particularly in antenna design and communication systems. With a remarkable portfolio of 26 patents, Liu continues to push the boundaries of engineering and technology.

Latest Patents

Liu's recent patents highlight his expertise and creativity in developing advanced technological solutions. One of his latest inventions is the "Method of embedding low-k materials in antennas." This invention involves a device that incorporates a patch antenna, featuring a feeding line and a ground panel with an aperture. It utilizes a low-k dielectric module aligned with the aperture, topped by a patch that enhances antenna performance.

Another notable patent is focused on the "Method of using integrated transmitter and receiver front end module." This innovative methodology allows for the efficient switching of receiver and transmitter path networks to optimize performance in both receive and transmit modes, demonstrating Liu's dedication to improving communication technologies.

Career Highlights

Monsen Liu currently works at Taiwan Semiconductor Manufacturing Company Ltd., where he has established himself as a key player in the semiconductor industry. His extensive knowledge and innovative mindset have led him to develop breakthrough technologies that are critically important in various communication applications.

Collaborations

Liu collaborates with esteemed professionals Chuei-Tang Wang and En-Hsiang Yeh, enhancing the innovative capabilities of their projects. Together, they work on advancing antenna technology and improving semiconductor solutions, fostering a collaborative environment that promotes creativity and efficiency in their endeavors.

Conclusion

Monsen Liu stands out as a leading inventor in the field of antenna technology, with a proven track record of patents and impactful innovations. His contributions to the industry not only reflect his talent and dedication but also signify the ongoing evolution of communication technologies that shape our connected world.

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