The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
May. 19, 2022
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
PO-Ying Lai, Hsinchu, TW;
Shuo-Mao Chen, New Taipei City, TW;
Monsen Liu, Hsinchu, TW;
Shang-Lun Tsai, Hsinchu City, TW;
Shin-Puu Jeng, Po-Shan Village, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
Devices and methods of manufacture for a hybrid interposer including a molding structure within a semiconductor device. A semiconductor device may include a semiconductor die, a package substrate, and a hybrid interposer positioned between the semiconductor die and the package substrate. The hybrid interposer may include a molding material layer, and an integrated device positioned within the molding interposer layer. The hybrid interposer may further include an organic material layer, and a non-organic material layer. The molding material layer may include an epoxy molding compound (EMC). The organic material layer may include a dielectric polymer material. The non-organic material layer may include a silicon-based dielectric material.