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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12368127 B1

PDFFull Text
Date of Patent:
Jul. 22, 2025

Filed:

May. 19, 2022

Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall

Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Po-Chen Lai, Hsinchu, TW;

Ming-Chih Yew, Hsinchu, TW;

Shu-Shen Yeh, Taoyuan, TW;

Po-Yao Lin, Zhudong Township, TW;

Shin-Puu Jeng, Po-Shan Village, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Attorney:

The Marbury Law Group, PLLC

Primary Examiner:

Younes Boulghassoul

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3135 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 25/105 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16135 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/26155 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81815 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/182 (2013.01); H01L 2924/186 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A fan-out package includes at least one semiconductor die attached to an interposer structure. a molding compound die frame laterally surrounding the at least one semiconductor die and including a molding compound material, and at least one stress buffer structure located on the interposer structure and including a stress buffer material having a first Young's modulus. The molding compound die frame includes a molding compound material having a second Young's modulus that is greater than the first Young's modulus.

Find Patent Forward Citations

Lai, Po-Chen. (2025). Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall (U.S. Patent No. 12368127). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12368127

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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