The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
May. 19, 2022
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Po-Chen Lai, Hsinchu, TW;
Ming-Chih Yew, Hsinchu, TW;
Shu-Shen Yeh, Taoyuan, TW;
Po-Yao Lin, Zhudong Township, TW;
Shin-Puu Jeng, Po-Shan Village, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
A fan-out package includes at least one semiconductor die attached to an interposer structure. a molding compound die frame laterally surrounding the at least one semiconductor die and including a molding compound material, and at least one stress buffer structure located on the interposer structure and including a stress buffer material having a first Young's modulus. The molding compound die frame includes a molding compound material having a second Young's modulus that is greater than the first Young's modulus.