The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
May. 24, 2022
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Yu-Sheng Lin, Zhubei, TW;
Shu-Shen Yeh, Taoyuan, TW;
Ming-Chih Yew, Hsinchu, TW;
Chin-Hua Wang, New Taipei, TW;
Shin-Puu Jeng, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A package includes a package substrate, the package substrate having a first side and a second side opposite to the first side, a package component bonded to the first side of the package substrate, a front-side warpage control structure attached to the first side of the package substrate, and a backside warpage control structure embedded in the package substrate from the second side of the package substrate. The front-side warpage control structure includes a first disconnected structure and a second disconnected structure laterally separated from each other by a gap. The backside warpage control structure includes a third disconnected structure and a fourth disconnected structure laterally separated from each other.