Hsinchu, Taiwan

Yu-Sheng Lin

Average Co-Inventor Count = 4.8

ph-index = 3

Forward Citations = 43(Granted Patents)

Forward Citations (Not Self Cited) = 32(Sep 21, 2024)

Location History:

  • Taichung, TW (2012 - 2022)
  • Hsinchu, TW (2001 - 2024)
  • Zhubei, TW (2020 - 2024)
  • Hsinchu County, TW (2023 - 2024)
  • Chupei, TW (2024)


Years Active: 2001-2025

where 'Filed Patents' based on already Granted Patents

70 patents (USPTO):

Title: Yu-Sheng Lin: A Pioneer in Semiconductor Innovations

Introduction

Yu-Sheng Lin, based in Hsinchu, Taiwan, is a distinguished inventor renowned for his significant contributions to the semiconductor industry. With an impressive portfolio of 49 patents, Lin has proven to be an innovator whose work continues to influence the evolution of semiconductor packaging technologies.

Latest Patents

Among Yu-Sheng Lin's latest inventions are two noteworthy patents concerning semiconductor packages. The first patent describes a semiconductor package featuring a redistribution structure, which includes a first and second semiconductor device, along with an underfill layer and an encapsulant. This innovative design ensures a strong electrical connection between the devices while optimizing space and enhancing performance.

The second patent focuses on a package structure and method of forming the same, which comprises a first tier with an interposer, a second tier containing a bottom die, and a third tier featuring multiple first dies and at least one second die. This arrangement not only improves signal and power paths but also enhances the overall functionality and efficiency of semiconductor packages.

Career Highlights

Throughout his career, Yu-Sheng Lin has held pivotal roles in leading companies within the semiconductor sector, including Taiwan Semiconductor Manufacturing Company Ltd. and E Ink Holdings Inc. His extensive experience and innovative approach have positioned him as a leader in the field, consistently pushing the boundaries of technology and design.

Collaborations

In his journey of innovation, Lin has collaborated with prominent professionals such as Shin-Puu Jeng and Po-Yao Lin, combining expertise to advance semiconductor packaging methods and systems. These collaborations reflect Lin's commitment to fostering teamwork and creativity in achieving breakthrough solutions.

Conclusion

Yu-Sheng Lin remains a trailblazer in the semiconductor industry, with a commendable track record of patents that demonstrate his ingenuity and dedication. As a leading inventor, his work continues to shape the future of semiconductor packaging, making significant impacts on technology and industry standards.

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