Average Co-Inventor Count = 4.79
ph-index = 3
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (55 from 40,053 patents)
2. Mediatek Corporation (6 from 4,698 patents)
3. E Ink Holdings Inc. (5 from 542 patents)
4. Accton Technology Corporation (2 from 234 patents)
5. Hannstar Display Corporation (1 from 646 patents)
6. Asia Optical Co., Ltd. (1 from 479 patents)
7. Win Coat Corporation (1 from 2 patents)
71 patents:
1. 12424558 - Bridge die having different surface orientation than IC dies interconnected by the bridge die
2. 12406898 - Chip package structure with lid
3. 12406897 - Package structure with buffer layer embedded in lid layer
4. 12406936 - Semiconductor package with substrate recess and methods for forming the same
5. 12387991 - Manufacturing method of semiconductor package
6. 12387992 - Package and method for forming the same
7. 12374561 - Chip package structure with ring dam
8. 12362299 - Basin-shaped underbump plates and methods of forming the same
9. 12362246 - Interposer including stepped surfaces and methods of forming the same
10. 12362268 - Package assembly including package substrate with elongated solder resist opening and methods for forming the same
11. 12362197 - Semiconductor die package with ring structure
12. 12362307 - Semiconductor package with ball grid array connection having improved reliability
13. 12362258 - Thermal module for a semiconductor package and methods of forming the same
14. 12347793 - Semiconductor package
15. 12327772 - Semiconductor package including stress-reduction structures and methods of forming the same